Interconnection


DDR SO-DIMM sockets

25 June 2014 Interconnection

Yamaichi has added new SO-DIMM sockets for DDR2 and DDR3 computing memory generations.

The CN111S was developed especially for modules that meet the DDR2 (double data rate) standard in the SO-DIMM format (small outline dual inline memory module). It is designed for 200-pin, 1,8 V memory with an installation height of 5,2 mm and gold-plated contacts as standard. For the DDR3 standard, the CN112S series is equipped with 204 gold-plated contacts (1,5 V) and a low installation height of 5,2 mm.

Both series utilise a contact design that strikes a balance between optimum engaging forces and high contact forces. This ensures that the contacts always make a stable connection to the module. The design also ensures that the contact force is continuous even in environments that include dust or contamination. The module is reliably inserted by means of two lateral rails that support and guide it.

Both the CN111S and the CN112S have been developed and tested in accordance with the JEDEC standard. Due to their low installation height, they are ideal for applications in notebooks in a wide variety of markets, like consumer electronics, medical technology and even the industrial PC sector.

The sockets are supplied in tape-and-reel, and are compatible with automated surface mount assembly processes.

For more information contact Brian James, Brabek, +27 (0)21 706 3162, [email protected], www.brabek.co.za



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