MEMSIC has created the world’s first monolithic 3D accelerometer, and the first to utilise wafer-level packaging technology, translating directly to a 60% reduction in cost and a 50% reduction in size. The MXC400xXC provides 12-bit resolution on all three axes, programmable FSR of ±2 G/±4 G/±8 G, an 8-bit temperature output, plus orientation/shake detection. It comes in a package size of 1,2 x 1,7 mm and has no moving parts, making the sensor structure extremely robust to shock and vibration – it can withstand shock in excess of 200 000 G with no change in performance. This is critically important to wearable and many consumer applications.
MCU for low-power, IoT applications NuVision Electronics
DSP, Micros & Memory
Silicon Labs recently announced the PG26, a general-purpose microcontroller with a dedicated matrix vector processor to enhance AI/ML hardware accelerator speeds.
Read more...IMU with dual-sensing capability EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.
Read more...ICs vs modules: Understanding the technical trade-offs for IoT applications NuVision Electronics
Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.
Read more...Marktech’s latest LEDs and photodiodes NuVision Electronics
Test & Measurement
Designed for precision sensing and emission tasks, Marktech’s optoelectronic lineup serves medical, industrial, aerospace, and environmental markets.
Read more...Plural data converter series
Analogue, Mixed Signal, LSI
Silanna Semiconductor has announced the launch of Plural, a new generation of data converters for customers eager to find a more available, affordable, high-performance alternative to existing brands.
Read more...Why bis means business for LTE Cat 1 IoT connections NuVision Electronics
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Tomaž Petaros, product manager IoT EMEA at Quectel Wireless Solutions explains why the market for Cat 1bis IoT connections is getting busy.
Read more...Bluetooth Lite SoCs purpose built for IoT NuVision Electronics
Telecoms, Datacoms, Wireless, IoT
Whether it is enabling predictive maintenance on industrial equipment, tracking assets in dense environments, or running for years on a coin cell battery in ultra-low power sensors, developers need solutions that are lean, reliable, and ready to scale with emerging use cases.
Read more...Precision JFET op-amp Altron Arrow
Analogue, Mixed Signal, LSI
The specifications of the ADA4620 make it optimal as a front-end amplifier in a data-acquisition system, or for a TIA circuit with high input impedance.
Read more...High-speed Flash for SoC applications NuVision Electronics
DSP, Micros & Memory
GigaDevice has unveiled the GD25NE series of dual-power supply SPI NOR Flash chips, designed specifically for 1,2 V system-on-chip (SoC) applications.
Read more...A new era in modular I/O solutions Rugged Interconnect Technologies
Analogue, Mixed Signal, LSI
Aerospace and defence system designers are demanding scalable and high-performance I/O solutions and while traditional mezzanine standards have proven reliable, they often fall short of meeting modern bandwidth, size, and flexibility requirements.
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