MEMSIC has created the world’s first monolithic 3D accelerometer, and the first to utilise wafer-level packaging technology, translating directly to a 60% reduction in cost and a 50% reduction in size. The MXC400xXC provides 12-bit resolution on all three axes, programmable FSR of ±2 G/±4 G/±8 G, an 8-bit temperature output, plus orientation/shake detection. It comes in a package size of 1,2 x 1,7 mm and has no moving parts, making the sensor structure extremely robust to shock and vibration – it can withstand shock in excess of 200 000 G with no change in performance. This is critically important to wearable and many consumer applications.
High-temperature closed-loop MEMS?accelerometer RS South Africa
Analogue, Mixed Signal, LSI
This sensor from TDK is a high-temperature MEMS accelerometer with ±14 g input range and a digital interface for measurement while drilling applications.
Read more...Dual accelerometers on the same die Altron Arrow
Analogue, Mixed Signal, LSI
The LSM6DSV320X is the first mainstream inertial sensor to house a gyroscope alongside two accelerometers, one capable of sensing up to ±16 g and one sensing up to a staggering ±320 g.
Read more...Dual-range IMU with edge processing EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s innovative LSM6DSV80X combines two accelerometer structures for 16 g and 80 g full-scale sensing, a gyroscope up 4000 dps, and embedded intelligence in a single component.
Read more...Enhance SiC device efficiency using merged-pin Schottky diodes NuVision Electronics
Editor's Choice Power Electronics / Power Management
Silicon carbide (SiC) has advantages over silicon (Si) that make it particularly suitable for Schottky diodes in applications such as fast battery chargers, photovoltaic (PV) battery converters, and traction inverters.
Read more...Redefining entry-level MCUs NuVision Electronics
DSP, Micros & Memory
The company positions the GD32C231 series as a ‘high-performance entry-level’ solution designed to offer more competitive options for multiple applications.
Read more...High-reliability isolation amplifiers EBV Electrolink
Analogue, Mixed Signal, LSI
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.
Read more...Mibbo QT2C Series signal isolators Conical Technologies
Analogue, Mixed Signal, LSI
The Mibbo QT2C Series isolators support a rich combination of input and output signals, working with either current loops or voltage levels.
Read more...MCU for low-power, IoT applications NuVision Electronics
DSP, Micros & Memory
Silicon Labs recently announced the PG26, a general-purpose microcontroller with a dedicated matrix vector processor to enhance AI/ML hardware accelerator speeds.
Read more...IMU with dual-sensing capability EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.
Read more...ICs vs modules: Understanding the technical trade-offs for IoT applications NuVision Electronics
Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.
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