The demand for faster, higher-performance bus systems at lower prices is growing stronger. With the Intel PCI bus a de facto standard has emerged in the desktop computer field which meets these demands.
PCI (Peripheral Components Interconnect) is a processor independent 32 bit bus (33 MHz synchronous clock) which also supports 64 bit processing. A data transfer rate of up to 264 MBps can be achieved. Burst mode transfers of differing lengths are of particular benefit to specially data-intensive applications such as graphics. Conventional 5,0 V logic and the new 3,3 V logic are supported.
In 1994 the PCI Industrial Computer Manufacturers Group (PICMG) was founded, with the object of making available the performance capability of the PCI bus on an industrial scale.
The new industry standard defined by the PICMG is designated CompactPCI, and has the following features:
* Electrically identical to the PCI bus (use of standard PCI chipsets and software possible).
* Eurocard format (3U and 6U).
* Standard 19" rack.
* Metric connectors 2,0 mm grid.
As a result of this combination CompactPCI is a high-performance system which meets the demands of hostile industrial environments, and based on the use of standard components is cost-effective.
PICMG specifies metric connector systems in a 2,0 mm grid for CompactPCI. The associated requirements in terms of form factor and high-frequency properties are met by the new ERmet connector generation from ERNI. For a 3U slot, connector module A with 110 signal contacts and a so-called multifunction area, together with a modified module B also with 110 signal contacts, are required. This provides 220 pins (five rows each of 44 pins), which 20 pins are reserved for future applications and extensions. Cards which only support 32 bit-transfer can only be operated with a module A connector. The upper shielding on the connector serves to adapt impedance, and is also part of the specification.
New generation of SBCs
Computer/Embedded Technology
HardKernel’s new generation of ODROID H4-series SBCs are more powerful; offering higher performance and richer interfaces than previous generations.
Read more...Smallest 13th gen Intel SBC Vepac Electronics
Computer/Embedded Technology
At just 86 x 55 mm, the de next-RAP8 continues AAEON’s run of producing record-breaking single-board computers with embedded Intel technology.
Read more...Versatile PoE extender Vepac Electronics
Computer/Embedded Technology
The GP-101ET PoE+ Extender is a 1-port Gigabit PoE extender with plug and play installation requiring neither configuration nor extra electrical power.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...Film and mica capacitors Actum
Passive Components
By utilising various polymer dielectrics plastics, Exxelia film and mica capacitors meet most technical requirements and serve all functions from standard filtering to specialised applications.
Read more...QuecPi smart development board iCorp Technologies
Computer/Embedded Technology
The QuecPi Alpha smart MOB development board is Quectel’s smart development board based on Qualcomm’s QCS6490 high-performance 64-bit octa-core processor.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.