Zipper fin heatsinks
20 May 2015
Circuit & System Protection
Benefitting from high performance and light weight, zipper fin heatsinks from Advanced Thermal Solutions can be used to cool LEDs, as well as hot components in telecom, datacom, military and embedded electronics.
Zipper fins are machined from thin sheet metal, typically aluminium or copper, and are formed into custom shapes. The sheets are designed to interlock with a very narrow space between their layers. The fin assembly is wave soldered to a metal base forming a very rigid, lightweight heatsink.
The production process yields a lower-cost heatsink than bonded fin designs, mainly because bonded heatsinks require more expensive tooling to manufacture. Zipper fin heatsinks can also be made in high aspect ratio fin profiles, enabling taller, thinner and more tightly packed fins for higher cooling performance.
Zipper fin sinks can be designed with integral ducts to contain and optimise cooling airflow. This improves thermal performance, particularly with active sinks that receive airflows from fans and blowers. For many of these designs, the top surface of the heatsink can also be used as a heat spreader for hot components.
Zipper fin heatsinks allow the combined use of copper and aluminium materials. In these designs, the copper base allows for optimal heat spreading while the aluminium fins ensure the heatsink will be lightweight.
For more information visit www.qats.com
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