Programmable Logic


FPGAs packing Flash memory

10 June 2015 Programmable Logic

The newest member of Lattice Semiconductor’s MachXO3 FPGA range – MachXO3LF – provides essential bridging and I/O expansion functions to meet the increasing connectivity requirements of communications, computing, consumer and industrial markets. Featuring Flash memory on-chip for configuration and usage, the device utilises the same advanced package technology as the MachXO3L family, thus providing a small footprint and high I/O density. Pin-out compatibility allows customers to easily migrate between MachXO3L and MachXO3LF devices without changing printed circuit board design.

Future Electronics, +27 (0)21 421 8292, [email protected], www.futureelectronics.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Next generation HMI processing platform
Future Electronics DSP, Micros & Memory
Microchip’s latest hybrid MCU SiP integrates an Arm926EJ-S processor with 512 Mb of DDR2 SDRAM and is engineered to meet the rising demand for sophisticated HMI solutions in modern vehicles.

Read more...
MIL-spec connector series
Future Electronics Interconnection
The MIL-HD2 connector series from Amphenol is the company’s next-generation, SOSA-aligned solution engineered to meet the most demanding requirements of modern military embedded systems.

Read more...
Next-generation HMI and vision processing
Future Electronics Edge Computing & IIoT
The Renesas RA8D2 group of microcontrollers delivers ultra-high performance for next-generation graphics, HMI, and vision-driven designs that demand fast response, rich visual interfaces, and embedded AI capability.

Read more...
Chip for high-density power
Future Electronics DSP, Micros & Memory
Microchip’s dsPIC33AK256MPS306 Digital Signal Controllers combine high-resolution control, high-speed analogue, and security with support for post-quantum cryptography.

Read more...
Smarter compact automation with LOGO! 9
RS South Africa Programmable Logic
Siemens recently announced LOGO! 9, the latest generation of its compact logic controller designed for small automation projects in both industrial and building applications.

Read more...
Advanced industrial connectivity at the edge
Future Electronics Computer/Embedded Technology
Dual 4K display capabilities, ultra-efficient processing, and versatile mounting options make the Intelli TWL01 Edge the ultimate embedded platform for multimedia solution building.

Read more...
Compact high precision magnetometer
Future Electronics Test & Measurement
Bosch Sensortec has introduced the BMM350, a compact 16-bit, 3-axis magnetometer engineered to deliver high accuracy, low noise, and exceptional energy efficiency in space constrained designs.

Read more...
Standalone USB PD controller
Future Electronics Power Electronics / Power Management
The STUSB4531 from STMicroelectronics is a standalone USB Power Delivery sink controller designed to streamline the implementation of USB-C power negotiation in sink devices without requiring a full software stack on a host microcontroller.

Read more...
Compact power MOSFET for high current switching
Future Electronics Power Electronics / Power Management
onsemi’s NTMFSC2D6N08X is a high-performance 80 V N-channel power MOSFET engineered for demanding switching and power conversion applications.

Read more...
Wide input step-down DC-DC converter
Future Electronics Power Electronics / Power Management
The DCP3601 from STMicroelectronics is a wide-input, synchronous step-down DC-DC converter designed for compact and efficient power conversion in industrial and embedded systems.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved