DSP, Micros & Memory


First Cortex-M7 MCUs available en masse

22 July 2015 DSP, Micros & Memory

STMicroelectronics pronounced itself the winner of the race to commence volume production of microcontrollers (MCU) featuring the ARM Cortex-M7 processor.

Optimised for advanced consumer, industrial, medical and Internet-of-Things (IoT) devices, this latest and highest-performing Cortex-M core is harnessed by the company’s new STM32F7 family.

The Cortex-M7 core has roughly twice the digital signal processing (DSP) capability of the Cortex-M4 core – ideal for applications requiring high-speed or multi-channel audio, video, wireless, motion recognition or motor control. It is also the first Cortex-M core to feature on-chip cache, and is capable of ultra-fast data transfers and high-performance execution from embedded Flash or from external memories such as dual-mode Quad-SPI (QSPI).

Features integrated by ST include a dedicated power rail for the USB OTG peripheral, which enables USB connectivity to continue operating while the rest of the chip is powered at 1,8 V to save power. The dual clock domain on most peripherals allows the CPU speed to be reduced to minimise power consumption, while keeping the clock frequency unchanged on the communication peripherals.

The new devices comprise the STM32F745, STM32F746 and STM32F756 families. The STM32F745 has up to 1 MB of Flash memory on-chip, as well as 320 KB RAM, Ethernet, QSPI and camera interfaces, and a flexible memory controller (FMC). The STM32F746 extends this functionality with an onboard TFT-LCD controller. The STM32F756 extends this feature set further to include a crypto/hash processor providing hardware acceleration for AES-128/-192/-256, with support for GCM and CCM, Triple DES and hash (MD5, SHA-1 and SHA-2).

Running at up to 216 MHz, the devices deliver processing efficiency up to 6 CoreMark/mW at 1,8 V, typically consuming 100 μA in stop mode with all SRAM saved. This power efficiency is achieved through ST’s 90 nm chip fabrication process, unique ART Accelerator graphic engine that reduces Flash access time, and advanced voltage scaling and underdrive/overdrive that help optimise speed and power consumption.

The STM32F7 devices are available in a range of package options from a 14 x 14 mm LQFP100 to 28 x 28 mm LQFP208, plus 10 x 10 mm (0,65 mm pitch) UFBGA176, 13 x 13 mm (0,8 mm pitch) TFBGA216, and 5,9 x 4,6 mm WLCSP143. It is also possible for developers to re-use all STM32F4 software assets thanks to code compatibility with STM32F7.

Complementing and easing implementation with the new MCUs across a diversity of applications, the STM32F7 Discovery Kit comes with the comprehensive STM32Cube firmware library, as well as direct support from a wide ecosystem of software development tool partners and the ARM mbed online community.

The kit’s open hardware exposes the STM32F7 assets through an affordable, compact design including WQVGA touchscreen colour display, stereo audio, multi-sensor support, security and high-speed connectivity. Together with an integrated ST-Link debugger/programmer, expansion capability is provided through Arduino Uno connectivity support and immediate access to a large choice of specialised add-on boards.

For more information contact Arnold Perumal, Avnet South Africa, +27 (0)11 319 8600, [email protected], www.avnet.co.za





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

MCU for low-power, IoT applications
NuVision Electronics DSP, Micros & Memory
Silicon Labs recently announced the PG26, a general-purpose microcontroller with a dedicated matrix vector processor to enhance AI/ML hardware accelerator speeds.

Read more...
EEPROMs for industrial and military markets
Vepac Electronics DSP, Micros & Memory
Designed to ensure the data retention and the secure and safe boot of digital systems, the memory product line includes small and medium density EEPROMs from 16 kb to 1 Mb.

Read more...
PLCnext – Open, IIoT-ready industrial platform
IOT Electronics DSP, Micros & Memory
PLCnext can be used alongside an existing PLC system, collecting control system data via EtherNet/IP, PROFINET, or MODBUS, and can push this information to a cloud instance.

Read more...
ICs vs modules: Understanding the technical trade-offs for IoT applications
NuVision Electronics Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.

Read more...
Hardware quantum resistance to embedded controllers
Avnet Silica DSP, Micros & Memory
To help system architects meet evolving security demands, Microchip Technology has developed its MEC175xB embedded controllers with embedded immutable post-quantum cryptography support.

Read more...
High-performance processor for edge-AI
Altron Arrow DSP, Micros & Memory
The STM32MP23 microprocessor from STMicroelectronics is the latest addition to the STM32MP2 series, designed to meet the demands of industrial, IoT, and edge AI applications.

Read more...
PolarFire SoC FPGAs achieve AEC-Q100 qualification
ASIC Design Services DSP, Micros & Memory
Microchip Technology’s PolarFire SoC FPGAs have earned the Automotive Electronics Council AEC-Q100 qualification.

Read more...
Integrated STM32WBA6 wireless microcontrollers
Altron Arrow DSP, Micros & Memory
Cost-efficient and highly integrated embedded controllers for emerging 2,4 GHz wireless applications in smart home, health, factory, and agriculture.

Read more...
Ultra-low-power MCU with FPU Arm Cortex-M33
Altron Arrow DSP, Micros & Memory
STMicroelectronics has expanded its STM32 ultra-low-power family with the launch of the STM32U3 for cost-sensitive applications in industrial, medical, and consumer electronics devices.

Read more...
Low-jitter oscillators
DSP, Micros & Memory
The JOH21, JOE21 and JOD21 low-jitter oscillators with differential output are designed for applications that require accurate timing and precise synchronisation.

Read more...