Samtec’s family of SEARAY open pin field arrays has expanded to include a right angle socket with press fit terminations for increased design flexibility and high retention. This socket is a high-density solution for micro backplane applications with Samtec’s Edge Rate contact system optimised for signal integrity.
Available in 8- and 10-row designs with up to 500 total I/Os on a 1,27 mm pitch grid, the SEAFP-RA series delivers maximum grounding and routing flexibility, low insertion/extraction forces and high cycle life. Optional guide post holes aid in proper alignment when mating with SEARAY terminal arrays, which are also available in right angle and press fit terminations.
The featured Edge Rate contact system increases cycle life and minimises the effects of broadside coupling, which decreases crosstalk for superior signal integrity performance and impedance control. This rugged contact system is also less prone to damage when ‘zippered’ during unmating.
Meeting the demands of mmWave with Samtec high-performance RF solutions Spectrum Concepts
Interconnection
[Sponsored] The appetite of modern technology for ever-higher data rates and transmission speeds seems to be insatiable, and this is especially apparent in the drive towards mmWave technologies.
Read more...Robust series of vertical-mating battery connectors Electrocomp
Interconnection
KYOCERA AVX has further expanded its industry-leading selection of standard battery connectors with the introduction of the new 9155-900 Series 2,5 mm-pitch vertical-mate battery connectors.
Read more...High current and voltage interconnect Hiconnex
Interconnection
The 972 series interconnect from Glenair ensures peak performance for the latest specification requirements in high-current, high-voltage, and high-frequency commercial aircraft applications.
Read more...M12 panel mount connectors Communica
Interconnection
Binder, a specialist in industrial circular connectors, offers a particularly wide range of M12 panel mount connectors that cover a wide variety of connection types, materials, and fastening solutions.
Read more...Blade terminals deliver greater power density Spectrum Concepts
Interconnection
[Sponsored] Connectivity has become more important as designers pack more power into smaller spaces, all while managing thermal loads and ensuring efficiency.
Read more...Halo mid-board optical transceiver Spectrum Concepts
Opto-Electronics
The Samtec Halo mid-board transceiver has been designed for next-generation embedded applications that require 56 and 112 Gbps PAM4 performance in low profile and ruggedised form factors.
Read more...Innovation in high-frequency cable design Spectrum Concepts
Telecoms, Datacoms, Wireless, IoT
[Sponsored] With frequencies approaching 110 GHz, a mismatch in impedance, an increase in insertion loss, or minute phase distortion can be the difference between success and failure.
Read more...New connector for Push-X technology Phoenix Contact
Interconnection
Phoenix Contact is extending the series of PCB connectors with innovative Push-X technology to include a new connector for conductor cross-sections up to 2,5 mm2.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version