DSP, Micros & Memory


MCU integrates transimpedance amp

18 May 2016 DSP, Micros & Memory

Texas Instruments is looking to give customers the ability to extend battery life in sensing and measurement applications with the new MSP430FR2311 microcontroller (MCU), the industry’s first with an integrated low-leakage

transimpedance amplifier (TIA) consuming just 50 pA of current.

According to TI, the new microcontroller – an expansion of the ultra-low-power MSP430 family – offers 20 times lower leakage than alternative voltage and current sensing solutions and provides the configurability of analog and memory technology without sacrificing battery life or board space.

The MSP430FR2311 allows developers to connect to a wide range of sensors with its analog integration including ADC, op-amp, comparators and TIA. This solution also integrates ferroelectric random access memory (FRAM) technology and eliminates the need for an onboard crystal in a single 3,5 x 4 mm package.

The new MCU allows developers to choose the amplifier configuration (non-inverting, inverting or transimpedance) they need and scale their application by selecting the amount of memory to be allocated for application code or data, eliminating the boundaries of Flash to RAM ratios.

Customers can get started in minutes using the MSP430FR2311 MCU LaunchPad development kit supported by Code Composer Studio integrated development environment (IDE) and IAR Embedded WorkBench. Customers can then explore an application implementation with the MSP430FR2311 smoke sensing sub-system reference design using a photodiode and TIA configuration for current sensing. Additionally, customers developing for medical health and fitness, building automation and personal electronics can further extend battery life by utilising the TIDA-00242 reference design which uses a TI energy harvesting IC (bq25570) in an MSP430FR2311 MCU-based system.

For more information contact EBV Electrolink, +27 (0)21 402 1940, [email protected], www.ebv.com



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