µ-blox, based in Thalwil, Switzerland, has released a low-power and highly miniaturised embedded computer system with high memory capacity it calls ROGER RSD.
The ROGER RSD measures 40 x 40 mm and provides a 225-pin ball grid array that allows handling like an electronic component. The module contains the Intel SA1110 StrongARM processor, up to 32 MB of Intel Strata flash EPROM, up to 64 MB of SDRAM, internal clock generation, reset logic and power supply for the CPU core. All bus, I/O, communication and LCD video signals, and 3,3 V power lines are available on ball grid array pins.
The following communication signals are available: three UARTs (RS232), 12 Mbps USB slave, signals for two PCMCIA slots, IrDA and general-purpose I/O ports. The CPU-internal video controller can operate with a wide range of displays and glueless connection to a Philips UCB 1200 CODEC provides analog audio, telephone and touch-screen sensing.
The ROGER modules fit best in application fields where at least one of the following requirements applies: low power dissipation, maximum CPU performance (235 MIPS at 206 MHz) and high memory demands, limited space, cost efficiency, fast time-to-market for both hardware and software and product longevity.
µ-blox provides a complete development kit with the ROGER module, and also includes Windows CE, operational device drivers and Embedded Visual Studio from Microsoft that provides C/C++ and Visual Basic.
Rugged, I/O-rich NVIDIA Jetson solutions Electronic Products Design
Computer/Embedded Technology
Developed for the NVIDIA Jetson AGX Orin, the Osbourne carrier and development kit is a compact and rugged platform designed to support a wide range of embedded AI and edge computing applications.
Read more...Choosing a GNSS receiver RF Design
Telecoms, Datacoms, Wireless, IoT
Applications requiring sub-ten-meter positioning accuracy today can choose between single-band or dual-band technology. While this decision might seem as simple as flipping a coin, it is far from that.
Read more...New generation of SBCs
Computer/Embedded Technology
HardKernel’s new generation of ODROID H4-series SBCs are more powerful; offering higher performance and richer interfaces than previous generations.
Read more...Smallest 13th gen Intel SBC Vepac Electronics
Computer/Embedded Technology
At just 86 x 55 mm, the de next-RAP8 continues AAEON’s run of producing record-breaking single-board computers with embedded Intel technology.
Read more...Versatile PoE extender Vepac Electronics
Computer/Embedded Technology
The GP-101ET PoE+ Extender is a 1-port Gigabit PoE extender with plug and play installation requiring neither configuration nor extra electrical power.
Read more...Energy harvesting and Matter for smarter homes RF Design
Power Electronics / Power Management
Qorvo’s collaboration with e-peas on the Matter Enabled Light Switch marks another significant step in advancing Matter adoption across the IoT industry.
Read more...Dual-band GNSS antenna RF Design
Telecoms, Datacoms, Wireless, IoT
The Taoglas Accura GVLB258.A, is a passive, dual-band GNSS L1/L5, high-performance antenna for high precision GNSS accuracy and fast positioning.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...Wi-Fi 7 front-end module RF Design
Telecoms, Datacoms, Wireless, IoT
The Qorvo QPF4609 is an integrated front end module designed for 802.11be systems that has integrated matching, which minimises layout area.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version