Texas Instruments introduced a reinforced isolated amplifier with what it claims are the highest reliability, lowest power consumption, highest DC accuracy and improved overall efficiency compared to competitive devices. The AMC1301 is the newest addition to the company’s reinforced isolation portfolio, which features the industry’s highest working voltage specifications.
With offset drift of just 3 μV/°C over the temperature range from -40°C to 125°C, the chip delivers a highly accurate solution for shunt-based current sensing in high-voltage equipment such as industrial motor drives, solar inverters, battery management systems and uninterruptible power supplies.
The AMC1301 has a working breakdown voltage of 1000 Vrms for a minimum insulation barrier lifetime of 64 years, which exceeds VDE0884-10 requirements. Like all of the isolated devices in TI’s portfolio, the AMC1301 has no relevant lifetime degradation, unlike optical components.
With an offset error maximum of 200 μV, very offset drift and linearity of 0,03%, the AMC1301 enables engineers to design the most accurate systems using an isolated amplifier over the widest temperature range, without having to compensate for DC and temperature drift errors.
A TINA-TI SPICE model and TINA-TI reference design are available for the AMC1301 to help designers verify board-level signal-integrity requirements. A TI Designs reference design is available, which allows designers to use the AMC1301 to jump-start design of a cost-efficient reinforced isolated power stage in three-phase inverters, with the benefits of reduced power supply requirements and protection against DC bus under- and over-voltage.
Understanding two key tools for cleaner serial data Altron Arrow
Editor's Choice Analogue, Mixed Signal, LSI
Understanding how pre-emphasis and equalisation works, and when to use one over the other, is critical when designing reliable high-speed systems.
Read more...Next-gen robotic systems initiative EBV Electrolink
Design Automation
EBV Elektronik recently introduced MOVE – Driving Robotics Forward, a new initiative designed by EBV Elektronik‘s Embedded Solutions team to support the development of next-generation robotic systems.
Read more...Compact high-current power inductor EBV Electrolink
Passive Components
Vishay’s IHLP series power inductors deliver high current capability in an ultra-low profile, magnetically shielded design.
Read more...Highly integrated 24-channel mixed signal IC EBV Electrolink
DSP, Micros & Memory
Microchip Technology has announced the LX4580, a 24-channel mixed-signal IC designed to replace multiple discrete components with a single device that supports synchronised data acquisition, fault monitoring, and motor control.
Read more...Touch-enabled 32-bit MCU EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Advanced pressure monitoring sensor EBV Electrolink
Test & Measurement
The Infineon KP497 is an advanced, highly integrated digital pressure sensor designed for demanding automotive and industrial applications, with a particular focus on battery management systems.
Read more...High-efficiency 600 V power MOSFET EBV Electrolink
Power Electronics / Power Management
The Infineon Technologies 600 V CoolMOS CFD7 is a high-voltage, super-junction N-channel MOSFET technology designed to deliver outstanding efficiency and robust switching performance.
Read more...High-performance FPGA family EBV Electrolink
DSP, Micros & Memory
AMD’s Kintex UltraScale+ FPGA family delivers high-performance, mid-range field programmable gate arrays that balance price, performance, and power efficiency for demanding DSP applications.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Automotive Ethernet communications EBV Electrolink
News
EBV Elektronik has expanded its automotive solutions offering with Infineon’s Marvell Automotive Ethernet portfolio.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.