7 September 2016
Telecoms, Datacoms, Wireless, IoT
Sierra Wireless announced a partnership to deliver the industry’s smallest integrated 2G to 4G cellular and GNSS modules solution. The reference design, which is available worldwide for free and was designed by AcalBFi, combines Sierra Wireless AirPrime HL Series embedded wireless modules with the OriginGPS Multi Spider (ORG4572) GNSS module that supports GPS and GLONASS.
The design is ideal for applications that require minimal power consumption and ultra-small form factors in markets such as wearables and IoT tracking, while ensuring high performance. The combined solution provides device manufacturers with the ability to serve different regions, across 2G, 3G and 4G network technologies with a single common footprint design and an easy migration path from GPS to multi-GNSS. To reach the highest integration level and shorten the time to market, GNSS modules are also available with an optional integrated antenna.
Sierra Wireless AirPrime HL Series modules are the smallest embedded wireless modules (22 x 23 mm) to be completely interchangeable across 2G, 3G, 4G LTE and future LPWA technologies. They use the CF3 form factor from Sierra Wireless, which is footprint compatible across product lines and network technologies and will remain fully interchangeable with future versions of the modules, including those for LPWA networks when they become available.
LTE-M technology is expected to provide a highly efficient cellular LPWA technology option for smart metering and smart grid applications, with lower RF complexity, significantly reduced power consumption, and better in-building signal penetration.
Low profile SMD antenna Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The Havok PCS.06.A antenna, from Taoglas, is a low profile SMD LTE/cellular 4G/3G/2G embedded antenna designed for direct SMD mount on a device PCB.
Read more...Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Simplifying system design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The FGMC63N tri-band MCU Wi-Fi 6E module from Quectel addresses offers integrated connectivity across 2,4 GHz, 5 GHz, and 6 GHz bands in a compact, highly optimised design.
Read more...Dragino’s connectivity catalogue Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Where Wi-Fi demands frequent charging and covers tens of meters, and traditional cellular consumes too much power for battery-operated nodes, LoRaWAN threads the needle.
Read more...RF filters explained RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
As RF environments become increasingly crowded, RF filters play a critical role in maintaining signal quality, improving system performance, and ensuring reliable operation.
Read more...Practical design strategies for 5G RF Design
Telecoms, Datacoms, Wireless, IoT
The Cavli CQM211 aims to provide a platform that combines strong 5G connectivity with onboard compute capability, as well as interface flexibility that suits both new designs and rapid migrations from earlier products.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version