STMicroelectronics has introduced new STM32F7 microcontroller lines and added accessories and options to the development ecosystem, easing access to high-performance embedded design based on the ARM Cortex -M7 core.
The latest STM32F722 and STM32F723 microcontrollers (MCU) in the very high-performance STM32F7 series reduce memory footprint by integrating value-added features including code execution protection and high-speed USB physical layer (PHY) circuitry that streamline development of connected applications. The STM32F732 and STM32F733 variants come with extra cryptographic features on-chip, such as an efficient AES256 HW engine. There are versatile package options from a 64-pin LQFP up to 176-pin LQFP or UFBGA for projects demanding high I/O count, and 256 KB or 512 KB of on-chip Flash memory with 256 KB RAM.
Extensive pin, package and software compatibility between the new devices and higher-end STM32F7 variants with 256 KB to 2 MB Flash memory and 256 KB to 51 2KB RAM in packages up to 216-pin TFBGA simplifies design scaling for product differentiation and future-proofing. STM32F7 projects can also be readily ported throughout the large STM32 microcontroller family, which contains over 700 devices that cover all 32-bit Cortex-M cores and offer a wide range of peripheral, pin count and memory options.
ST is also introducing a new Discovery Kit, based on the STM32F769, with expansion connectors that include an 8-pin socket for Wi-Fi modules. The kit supports Power over Ethernet (PoE). Other features include a 512 Mbit Quad-SPI (QSPI) Flash interface and new accessories that enhance flexibility and extend application reach, including the B-LCDAD-RPI1 15-pin single row flexible printed circuit DSI adaptor board and B-LCDAD-HDMI1 DSI-to-HDMI adaptor, which enhance flexibility to attach a wide variety of displays. The kit can also be supplied with the B-LCD40-DSI 4-inch WVGA capacitive touchscreen display pre-fitted, or without the display for extra affordability. The B-LCD40-DSI can be ordered separately if needed to upgrade the kit at a later date.
Advanced pressure monitoring sensor EBV Electrolink
Test & Measurement
The Infineon KP497 is an advanced, highly integrated digital pressure sensor designed for demanding automotive and industrial applications, with a particular focus on battery management systems.
Read more...High-efficiency 600 V power MOSFET EBV Electrolink
Power Electronics / Power Management
The Infineon Technologies 600 V CoolMOS CFD7 is a high-voltage, super-junction N-channel MOSFET technology designed to deliver outstanding efficiency and robust switching performance.
Read more...Quad RF ADC/DAC for wideband transceiver design Altron Arrow
DSP, Micros & Memory
The AD9084 from Analog Devices integrates a quad 16-bit RF digital-to-analogue converter with a maximum sampling rate of 28 GSPS and a quad 12-bit RF analogue-to-digital converter.
Read more...High-performance FPGA family EBV Electrolink
DSP, Micros & Memory
AMD’s Kintex UltraScale+ FPGA family delivers high-performance, mid-range field programmable gate arrays that balance price, performance, and power efficiency for demanding DSP applications.
Read more...Compact and scalable development board
DSP, Micros & Memory
The FRDM-MCXW72 from NXP is a compact and scalable development board for rapid prototyping of the MCX W72 multiprotocol wireless MCU.
Read more...High-performance processing for cost-aware industrial IoT Altron Arrow
DSP, Micros & Memory
STMicroelectronics has expanded its industrial processing portfolio with the new STM32MP2 series, a family of application microprocessors designed to deliver higher performance, advanced security and long-term reliability for cost-sensitive industrial IoT systems.
Read more...Development board for secure industrial and IoT applications
DSP, Micros & Memory
The FRDM-i.MX93 Development Board from NXP is a compact, entry-level platform built around the powerful i.MX 93 applications processor, designed to accelerate prototyping and development for industrial, IoT, and edge computing applications.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...Ultra-wide signal capture from a single chip RFiber Solutions
DSP, Micros & Memory
Jariet Technologies developed Electra, a chipset that enables ultra-wide, multi-function and multi-band signal capture and generation from a single component.
Read more...High-performance processing at the edge Altron Arrow
DSP, Micros & Memory
STMicroelectronics’ STM32MP23 microprocessor is designed to meet the demands of industrial, IoT, and edge AI applications.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version