Manufacturing / Production Technology, Hardware & Services


Low-cost robot simplifies complex tasks

22 March 2017 Manufacturing / Production Technology, Hardware & Services

RS Components has launched a new low-cost, fast and accurate robotics solution. Easy to programme, even for those who have never programmed a robotic arm before, the R12 and R17 benchtop robots from ST Robotics are capable of undertaking the most complex tasks, including product testing, sample handling, parts handling, machine feeding, welding, spraying and sound measurement.

Both models are supplied with controller, teach pad/pendant, all cables, connectors, RoboForthII and RobWin7 software with comprehensive manuals and, as a result, are ready to use immediately out of the box. Their high efficiency motor drives, solid machined-alloy construction and industrial-standard quality deliver high accuracy and reliability, making them suitable for 24/7 operation without failure.

The R12 model comes in five- or six-axis variants, offers a 500 mm reach and is capable of handling a 1 kg payload. The larger R17 model is a five-axis robot, with a six-axis option, and can handle a 3 kg payload over a reach of 750 mm. In total, RS will stock 38 standard lines comprising the two different robot arms, several gripper formats and actuation methods (pneumatic/electric) and numerous optional accessories, including an Android/Bluetooth teach pad, vacuum grippers and USB and TCP/IP converters.

With many years’ experience in the domain, ST Robotics boasts that its robots’ high intelligence finds them niches in the most complex tasks, where they will do most of what their big brothers do, much that they cannot do and at a fraction of the price.

RS is providing large amounts of supplementary support in the form of compatible and complementary product listings, tutorials and bespoke entries within the DesignSpark section of its website.

For more information contact RS Components, +27 (0)11 691 9300, [email protected], www.rsonline.com



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Ultra compact NTC thermistors
RS South Africa Test & Measurement
Murata Manufacturing Co. has expanded its compact NCU03 series of NTC thermistors with two ultra-small 0603M devices tailored for consumer and automotive designs.

Read more...
DC link capacitors for demanding applications
RS South Africa Power Electronics / Power Management
TDK Corporation has announced the B3271xP series of DC link film capacitors, offering high thermal robustness for demanding automotive and industrial power electronics.

Read more...
Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.

Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.

Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.

Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.

Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.

Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved