19 July 2017Manufacturing / Production Technology, Hardware & Services
Ersa has enhanced the capabilities of its Versaflow selective soldering systems with the development of the new Versaflex twin pot module. The two solder pots, developed specially for the Versaflow 4 selective soldering platform, are mounted on two independent axes and can be individually moved in x, y and z directions.
This allows the system to be used in conventional parallel operation, but also in an asynchronous mode, so that the two pots work completely independently of one another.
Operating software offers convenient support in generating the soldering programme. Via the ‘cycle optimisation’ function, the optimum soldering module route for the respective assembly can be automatically determined with the new CAD Assistant 4, and saved in the soldering programme. As this can all be done offline, the highest level of machine availability and therefore productivity is guaranteed.
Data sets for the CNC axis systems are processed simply by drag and drop; predefined data sets are quickly adapted to the specific application; and a sanity check rules out errors. All the movements of the fluxer or soldering axis system are entered graphically on the board image, furnished with process data and checked by simulation, and are immediately available in the machine.
The Versaflex Ultra software upgrade opens up maximum flexibility and further optimises processes with two pots, which move completely independently of one another in x/y/z directions. Autorouting allows even complex soldering programmes to be developed simply, by indicating the points or lines to be fluxed or soldered, after which the routes are defined automatically and efficiently by the CAD Assistant 4.
This latest generation of Ersa selective soldering system – the fourth – is rounded off with Ersasoft 5 operating software with modern visuals and a user-oriented structure. Individual user interfaces show the necessary data and information to each user group directly. The new interface also offers convenience in process monitoring – modern picture-in-picture technology (PIP) provides a clear view of the soldering parameters and a live image for optimum control in every soldering process.
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