Microchip has expanded into the low-end 'thin-client' CAN applications market with its family of input/output expanders. Microchip says it is currently the only semiconductor manufacturer to offer a small-packaged, full-featured, cost-effective alternative to microcontroller-based solutions with its family of MCP250XX I/O expanders. These small 14-pin PDIP or SOIC package devices have full CAN 2,0B Active capability, enabling transmits and receives of both standard and extended frames at up to 1 Mbps. Functionality includes eight I/O pins that can be configured as inputs or outputs. Analog input capability exists on selected versions with up to four 10 bit A/D converters. The devices can be configured to automatically transmit CAN messages on changes of either analog or digital inputs. Incoming CAN messages can change pin states or PWM output frequencies.
The MCP25025 and MCP25055 feature connected RxCAN and TxCAN pins for one-wire communication, providing a simple way to connect a small number of nodes together.
For thin client application a complete CAN node can be implemented using a single microchip CAN I/O expander, and once configured and running on a CAN bus the MCP250XX devices can be reconfigured through CAN bus messages, enhancing overall system flexibility.
STM releases innovative GNSS receiver Altron Arrow
Telecoms, Datacoms, Wireless, IoT
STMicroelectronics recently introduced the Teseo VI family of global navigation satellite system receivers aimed at high-volume precise positioning use cases.
Read more...Bluetooth module brilliance Avnet Silica
Telecoms, Datacoms, Wireless, IoT
Following the company’s popular PAN1780, the PAN1783 Bluetooth 5.3 Low Energy (LE) module from Panasonic is based on the Nordic nRF5340 single chip controller.
Read more...High-power radar band amplifier RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
The MAPC-A4032 is a Gallium Nitride (GaN) amplifier designed specifically with high efficiency and high power for the 2,75 – 3,75 GHz S-Band radar band.
Read more...NXP’s latest wireless chip solution Avnet Silica
Telecoms, Datacoms, Wireless, IoT
NXP’s IW610 wireless chip solution features a 1x1 dual-band Wi-Fi 6 radio subsystem, offering improved network efficiency, reduced latency and extended range.
Read more...High-accuracy positioning iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel has recently announced its LG580P, a multi-constellation, multi-band GNSS module designed for high-precision positioning that supports multi-band signals across L1, L2, L5, and L6.
Read more...LTE Cat 1 modules offer next-gen connectivity Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
The innovative LTE modules A7683E, A7663E, and A7673X have revolutionised IoT connectivity and saved costs for developers and circuit manufacturers.
Read more...Compact and powerful Bluetooth module Altron Arrow
Telecoms, Datacoms, Wireless, IoT
u-blox has introduced its ANNA-B5, a compact, powerful and secure Bluetooth LE module optimised for IoT applications.
Read more...2500 W GaN on SiC amplifier RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
Macom’s recently released CGHV1420KF is a 2500 W package, partially matched amplifier utilising a high performance, GaN-on-SiC production process.
Read more...Boost your LTE/5G signal Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Reliable connectivity is essential in today’s world - whether you’re working from home, running a small business, or living in a rural area where mobile signals are weak.
Read more...Direct RF-sampling at microwave frequencies RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
Jariet Technologies’ vision for its RF-sampling transceivers at microwave frequencies is to move the sampling to the antenna frequency.