ON Semiconductor has released two new boards, or shields, further extending its recently launched Internet of Things (IoT) Development Kit (IDK) platform’s capabilities. With the addition of two new shields that include Bluetooth low energy technology and smart passive sensors (SPS), customers are now able to create diverse and unique use cases that target smart home/building, smart city, industrial automation and mHealth applications.
The Bluetooth low energy shield features the recently launched RSL10 multi-protocol Bluetooth 5 certified radio System-on-Chip (SoC). With the industry’s lowest deep sleep current and receive power, the RSL10 enables manufacturers to create IoT devices with extended battery life. The small form factor of the RSL10 delivers the ultra-compact, cost effective end designs demanded by low-power IoT sensor networks. By integrating the Bluetooth low energy shield with the IDK, customers get a complementary choice of connectivity for extending reach, and sensing and actuator options, including lighting and motors.
The SPS shield extends the IDK to capture data from ON Semiconductor’s battery-free wireless sensors that measure temperature, moisture and pressure. The sensors are ideal for industrial and other applications with hard-to-access areas where zero maintenance is a necessity, and battery replacement is a challenge. Pairing the SPS shield with the IDK enables rapid prototyping of IoT applications that require battery-free sensing and wide-area or local connectivity and actuation options.
Both new shields expand the configurable, modular options for sensing, actuation and wired/wireless connectivity of the IDK, thereby giving application designers complete flexibility agnostic of the communication protocol chosen. They offer rapid and easy start-up of projects right out of the box, allowing developers to deliver data directly into the cloud, thereby enabling value-added services, including analytics.
IDK shields are supplied with full documentation including complete design schematics, PCB layouts and Gerber files to facilitate rapid transition of designs from concept, through development and into production. The industry standard interfaces ensure that current and future modules from ON Semiconductor and other vendors can be seamlessly integrated into designs while the simple ‘cut-and-paste’ approach to end product design reduces R&D time, expense and risk.
Intelligent video processing Rugged Interconnect Technologies
Computer/Embedded Technology
The CHARM150AGX is based on a NVIDIA AGX Orin embedded processor, which incorporates a multicore ARM processor and powerful AI/ML accelerator.
Read more...Compact low-power 32-bit platform EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Nordic expands nRF Cloud with firmware vulnerability scanning RF Design
Computer/Embedded Technology
nRF Cloud identifies vulnerabilities in firmware and shows exactly which deployed devices are affected, empowering device manufacturers to address EU Cyber Resilience Act requirements.
Read more...Arrival of the Epic-PTH9 Vepac Electronics
Computer/Embedded Technology
AAEON introduces the EPIC-PTH9, a compact 4-inch industrial single-board computer powered by Intel Core Ultra Series 3 (formerly Panther Lake) processors.
Read more...An industry-first Android 16 smart module solution RF Design
Computer/Embedded Technology Telecoms, Datacoms, Wireless, IoT
The MeiG Smart SLM580 4G Smart Module features native support for Android 16 and covers core frequency bands in major countries and regions worldwide.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version