The new XEL50xx family of high-performance, moulded power inductors from Coilcraft offer exceptionally low DC resistance and ultra-low AC losses, greatly improving power converter efficiency at high frequencies (2 to 5+ MHz) and high ripple current.
The use of high switching frequencies or high ripple current allows a corresponding lower inductance value, which results in a physically smaller part for the same electrical specs. XEL50xx inductors measure just 5,28 x 5,48 mm with a maximum height of 3,2 mm.
The product range is currently available in two models, the XEL5020 and XEL5030. A third model, the XEL5050, is expected late Q2 2018. The XEL5020 is available in six inductance values from 0,10 to 1,0 μH, with current ratings up to 39 A. The XEL5030 has ten values from 0,13 to 4,7 μH and current ratings up to 44 A. All models offer soft saturation characteristics to withstand high current spikes and have no thermal ageing issues.
The inductors are qualified to AEC-Q200 Grade 1 standards (-40°C to +125°C ambient) with a maximum part temperature of +165°C, making them suitable for automotive and other harsh-environment applications. They feature RoHS-compliant, tin-silver-over-copper terminations and are halogen free. Their composite construction also minimises audible buzzing.
PCB connectors for power systems Phoenix Contact
Passive Components
With the new PC 6 PCB connectors with screw connection, Phoenix Contact’s classic connection technology is available with enhanced touch protection for the new pin connector pattern.
Read more...SPE connector range Phoenix Contact
Passive Components
Single Pair Ethernet (SPE) is a communication technology that realises Industry 4.0 and IIoT applications, and Phoenix Contact’s Combicon range are ideal for SPE connections.
Read more...TDK expands MLCC series RS South Africa
Passive Components
TDK Corporation has expanded its CGA series of multilayer ceramic capacitors, currently being the highest capacitance in 100 V products for automotive applications.
Read more...SiP supports LTE/NB-IoT and GNSS RF Design
DSP, Micros & Memory
The nRF9151 from Nordic Semiconductor is an integrated System-in-Package that supports LTE-M/NB-IoT, DECT NR+ and GNSS services.
Read more...Nordic expands nRF91 series RF Design
DSP, Micros & Memory
Nordic Semiconductor has announced the expansion of its nRF91 series cellular IoT devices with the introduction of the nRF9151 System-in-Package (SiP).
Read more...LEXI-R10 series cellular module RF Design
Telecoms, Datacoms, Wireless, IoT
The LEXI-R10 Series from u-blox are LTE Cat 1 bis modules that support multi-band LTE-FDD, and are designed for size-constrained devices.
Read more...LTE-M modules with integrated GNSS RF Design
Telecoms, Datacoms, Wireless, IoT
u-blox introduces new LTE-M modules with integrated GNSS to boost industrial connectivity. The SARA-R52 and LEXI-R52 series optimise cost and performance, while eliminating the need for extra components.
Read more...Marki Microwave introduces Prodigy RF Design
Telecoms, Datacoms, Wireless, IoT
Marki Microwave has introduced a new automated filter design tool called Prodigy, which brings MMIC filter design capability directly to the user.
Read more...Nordic tech tour RF Design
News
Join the Nordic Tech Tour EMEA, and stay ahead in a rapidly evolving IoT landscape.
printer friendly version