Manufacturing / Production Technology, Hardware & Services


Highly balanced solder paste

1 January 2019 Manufacturing / Production Technology, Hardware & Services

In today’s manufacturing environment, a totally balanced, high-performance solder paste with features like high wetting, ultra-low solder balling and low voiding, is required. At the same time, more emphasis is placed on achieving a stable printing process, so a stable viscosity is vital.

S3X58-G801, a general-application solder paste from KOKI with highly balanced SMT performance, is engineered with a highly heat-resistant flux that stays inactive at ambient temperature, thereby ensuring stable viscosity of the solder paste on the shelf and during continuous printing. This heat resistance effectively prevents heat-slump and eliminates the occurrence of solder balls. Furthermore, the solder paste achieves low voiding thanks to the fluidity of the flux, which reduces the generation of gas during the reduction reaction.

S3X58-G801 is a process-friendly, drop-in replacement solder paste that reduces the hassle of changing the material and ensures high-quality solder joints.

For more information contact Zetech, +27 11 609 1244, [email protected], www.zetech.co.za



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