Dual-side cooling package doubles current density

Power Electronics / Power Management

13 March 2002 Power Electronics / Power Management

International Rectifier has introduced what it says is the industry's first dual-side cooling power package that doubles current density in high current DC-DC converters. This surface-mount power MOSFET packaging technology called DirectFET, is the first surface-mount package in an SO-8 footprint designed for efficient topside cooling.

In combination with improved bottom-side cooling, the new package can be cooled on both sides to cut MOSFET part count by up to 60% and shrink board space by as much as 50% compared to an SO-8 type solution. This effectively doubles current density.

A dual-side cooled DirectFET chipset enables DC-DC converters capable of 30 A per phase with a single pair of MOSFETs, at a lower total system cost when compared to single-side cooled SO-8 designs. The new devices are designed for high-frequency, high-current DC-DC converters used to power next generation microprocessors.

Managing heat loads in high power microprocessor systems is a true challenge when the PCB is the main source of heat dissipation. Standard SO-8 packages, as well as proprietary SO-8 derivatives such as bottomless and leadless SO-8, can only effectively be cooled on one side through their connection to the PCB due to their poor top-side thermal resistance, adding to the thermal challenge.

DirectFET packaging can be leveraged to reach high current levels without paralleling MOSFETs, adding an additional phase in multiphase converters, using heat pipes or fans, or adding copper throughout the whole PCB, all of which reduce current density and add system cost. When comparing DirectFET solutions to these alternative designs, DirectFET is an economical solution, with at least a 50% reduction in the cost of heat removal, and provides the smallest space requirement.

The DirectFET package has a height of 0,7 mm, while the SO-8 is 1,75 mm. The devices are compatible with existing high-volume manufacturing equipment and processes.

Avnet Kopp

011 444 2333

sales@avnet.co.za

www.avnet.co.za

Share this article:

Surface mount power amplifier for high-power applications
RF Design Power Electronics / Power Management
The GNA-63-5W+, from Mini-Circuits, is a GaN MMIC Power Amplifier (PA) designed for demanding RF applications requiring high efficiency, excellent linearity, and a compact footprint.

Read more...

1200 V QSiC modules
Power Electronics / Power Management
SemiQ Inc has launched the QSiC Dual3, a family of 1200 V half-bridge MOSFET modules for motor drives in data centre cooling systems, grid converters in energy storage systems, and industrial drivers.

Read more...

MCOTS transient filter for military applications
RFiber Solutions Power Electronics / Power Management
SynQor has announced the new MCOTS-F-28-T-HE transient half-brick filter, the latest addition to its MCOTS product family.

Read more...

Expanded range of high-thermal-performance QSiC modules
Power Electronics / Power Management
SemiQ’s half-bridge series for data centre power converters and industrial motor drives features low RDSON SiC MOSFETs and parallel SBD diodes for best-in-class power density and conversion efficiency.

Read more...

Transporting lithium batteries and IoT devices
Power Electronics / Power Management
With billions of rechargeable and non-rechargeable lithium cells and batteries powering most of the world’s consumer and industrial electronic devices, shipping them to customers through vast global logistics chains is often an overlooked topic.

Read more...

Setting a new benchmark for high-power DC load testing
Conical Technologies Test & Measurement Power Electronics / Power Management
The new ITECH IT8900G/L high-speed, high-power DC electronic load offers a powerful combination of speed, scalability, precision and high-power density.

Read more...

Categories

Power Electronics / Power Management

Dual-side cooling package doubles current density

Further reading:

Publications by Technews