Telecoms, Datacoms, Wireless, IoT


Low-power IoT module in volume production

31 July 2019 Telecoms, Datacoms, Wireless, IoT

Nordic Semiconductor’s nRF9160 system-in-package (SiP) – an LTE-M/NB-IoT and GPS cellular IoT module – has entered the final volume silicon production phase, having successfully passed a series of major qualifications and certifications.

At just 10 x 16 x 1 mm in size, the device is suitable for compact consumer and medical wearables, and asset-tracking devices. Yet it is a complete solution that integrates everything a cellular connection and IoT application may need beyond requiring just an external battery, SIM and antenna. The nRF9160’s modem and microcontroller (MCU) were designed from the ground up for optimised power performance in IoT systems.

The SiP is also available on a powerful single-board development kit made for the IoT application developer. This kit comes with free development tool support, a cloud demonstration platform, and a software development kit (SDK) in GitHub with sample applications to provide a starting point for product development.

To achieve the module’s high level of integration, Nordic partnered with Qorvo to make an SiP that integrates application processor, power management, modem, RF front-end, crystals and passives. It also supports global operation with a single SiP variant, thanks to the combination of Nordic’s multimode LTE-M/NB-IoT modem, SAW-less transceiver, and a custom RF front-end solution from Qorvo.

The nRF9160 is the first cellular IoT module to incorporate Arm’s latest Cortex M33 CPU core, which is further supported by 1 MB of Flash and 256 KB of RAM on-board memory. It is also the first cellular IoT module to incorporate Arm TrustZone and Arm CryptoCell security for Internet-level encryption and application protection with Arm Cortex M-based devices.

Integrated GPS support allows a combination of GPS and cellular data to be used for more accurate positioning than either technology is capable of when used in isolation.

For more information contact Andrew Hutton, RF Design, +27 21 555 8400, [email protected]



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Wi-Fi 6 and Bluetooth LE co-processor
Altron Arrow Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released its ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE combo co-processor module.

Read more...
Improving accuracy of outdoor devices
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
In a real-world environment, accessing a direct satellite signal is not always possible, and it cannot be relied upon as the only solution to provide a device with accurate location at all times.

Read more...
New 3dB hybrid couplers
Electrocomp Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.

Read more...
Next-level Software Defined Radio
IOT Electronics Telecoms, Datacoms, Wireless, IoT
Great Scott Gadgets has announced the HackRF Pro, a powerful evolution of its popular Software Defined Radio (SDR) platform designed for engineers and enthusiasts.

Read more...
High-performance Zigbee and BLE module
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
The KCMA32S from Quectel boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports Zigbee 3.0, BLE 5.3 and BLE mesh.

Read more...
Championing local PCB manufacturing
Master Circuits Telecoms, Datacoms, Wireless, IoT
Master Circuits, founded in 1994 by Peter Frankish in Durban, was born from the vision to meet the growing local demand for quick-turnaround printed circuit boards in South Africa.

Read more...
How IoT-driven smart data helps businesses stay ahead
Trinity IoT Telecoms, Datacoms, Wireless, IoT
With around 19 billion IoT devices globally, embedded in everything from machinery to vehicles to consumer products, reliable data is plentiful.

Read more...
IoT-optimised LTE Cat 1 bis module
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel’s EG915K-EU is an LTE Cat 1 bis wireless communication module specially designed for M2M and IoT applications.

Read more...
Chip provides concurrent dual connectivity
EBV Electrolink Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.

Read more...
Nordic Semiconductor acquires Memfault
RF Design News
With this acquisition, Nordic has launched its first complete chip-to-cloud platform for lifecycle management of connected products.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved