23 October 2019
Manufacturing / Production Technology, Hardware & Services
The Select Coat applicator series from Nordson Asymtek – which includes the SC-350 Select Spray and the SC-300 Multi-Mode – is a highly versatile conformal coating applicator that supports a wide range of fluid viscosities and is ideal for solvent or solvent-less fluid formulations. The series features fast system on/off times to optimise start and stop movements; and an optional four-position tilt accessory and dual-simultaneous bracket configuration that delivers improved throughput and reduced process time.
The SC-350 Select Spray is specifically optimised to atomise coating fluids – delivering enhanced edge definition and thin, uniform coating thicknesses at increased speeds. It offers additional flexibility within process parameters at the low and high end of the viscosity spectrum exclusively for atomised spray. It efficiently sprays solvent-based fluids while reducing solvent usage and the ‘cobwebbing’ effect that occurs when coating fluids cure in air. In the higher viscosity range, the applicator provides uniform pass coverage at faster speeds.
With the SC-350, the air assist function is optimised to deliver significant edge tolerance, fluid viscosity, and coating velocity improvements. The applicator applies less air pressure to achieve a tighter edge tolerance, providing increased selectivity and control near keep-out zones and reduced ‘cobwebbing’ of solvent-based fluids.
The versatile SC-300 Multi-Mode offers bead, monofilament, and swirl modes of operation that are ideal for applications that require spot coating, broad pattern widths, and thin film builds.
In bead mode, a stream of material is applied to the circuit board in areas where components are very close to non-coating or keep-out areas, or extra material is required for protection of high-impedance areas. The bead may also be used as a spot command for single coating of a single test point or component.
In monofilament mode, this pattern is created by controlling the fluid pressure and material flow passing through the nozzle. Auxiliary air circulating through the air passage strikes the material at a precise angle, causing it to spin on its axis and form a conical, looping pattern. The monofilament pattern is ideal for dispensing broad pattern widths while maintaining good edge definition, resulting in faster cycle times.
The swirl pattern is a coarse atomised spray achieved by increasing air pressure and lowering flow settings. Angled jets impinge air upon the pressurised material exiting the nozzle, creating a conical, swirling pattern. The mode is ideal for applications where moderate selective coating is required. The swirling action helps maintain pattern shape, resulting in excellent width control. Because the air jets cause slight atomisation of the material, extremely thin film builds are possible.
Delivering uniform thicknesses and consistent pattern widths for a wide range of fluid viscosities, Select Coat applicators can be configured to meet a variety of application requirements including spot, line, area-coat, and optimised atomisation.
Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.
Read more...MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.
Read more...The impact of harsh environments and ionic contamination on post-reflow circuit assemblies MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.
Read more...Engineering copper grain structure for high-yield hybrid bonding in 3D packaging Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
Read more...Understanding solder dross: causes and control strategies Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
Read more...Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.
Read more...The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.
Read more...Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version