Telecoms, Datacoms, Wireless, IoT


Bi-directional optical module

19 June 2002 Telecoms, Datacoms, Wireless, IoT

Infineon Technologies has presented a new family of optical components for two-way communication over a single fibre. The costs of bi-directional optical components have dropped to a level where the assembly cost for the PCB becomes a major share of the total cost of ownership. The company's T-BIDI eliminates the need for pin bending, eliminates fibre handling during PCB assembly, and allows an automatic wave soldering process, thus significantly reducing assembly costs.

The bi-directional T-BIDI module consists of a laser and a pin diode with optional pre-amplifier. The emitter and receiver of the T-BIDI are placed in hermetically sealed TO cans and are located at the same side of the module. This makes the module easy to mount anywhere on a PCB, either at the edge or in the middle. Different laser types are available as well as received models with integrated low-noise pre-amplifier. The standard version of the T-BIDI features an MU or LC receptacle.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Full sensor to cloud solution
CST Electronics Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.

Read more...
Long-range Wi-Fi HaLow module
TRX Electronics Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.

Read more...
Quectel launches 3GPP NTN comms module
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.

Read more...
SIMCom’s A7673x series
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.

Read more...
Accelerating the commercialisation of the 5G IoT markets
Altron Arrow Editor's Choice Telecoms, Datacoms, Wireless, IoT
Fibocom unveils Non-Terrestrial Networks (NTN) module MA510-GL, enabling satellite and cellular connectivity to IoT applications.

Read more...
Long-range connectivity module
Avnet Silica Telecoms, Datacoms, Wireless, IoT
Digi XBee XR 868 RF Modules support the deployment of long-range connectivity applications, and support point-to-point and mesh networking protocols.

Read more...
4G LTE-M/NB-IoT connectivity reference design
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Developed around the industry-leading Nordic nRF9160 module, the platform comes complete with a newly-developed LTE antenna, ATRIA, which is pre-certified to operate over the full LTE-M and NB-IoT bands.

Read more...
Antennas to meet all connectivity requirements
Electrocomp Telecoms, Datacoms, Wireless, IoT
Kyocera AVX RF antennas meet today’s connectivity demands in the LTE, Wi-Fi, Bluetooth, GNSS, and ISM wireless bands, available in surface mount, patch or external configurations.

Read more...
Introducing SIMCom’s new A7673X series
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat 1 bis module that supports LTE-FDD, with a maximum downlink rate of 10 Mbps and an uplink rate of 5 Mbps.

Read more...
18 W monolithic microwave amplifier
RFiber Solutions Telecoms, Datacoms, Wireless, IoT
The CHA8612-QDB is a two stage, high-power amplifier operating between 7,9 and 11 GHz. The monolithic microwave amplifier can typically provide 18 W of saturated output power and 40% of power-added efficiency.

Read more...