Intersil has developed a highly integrated RF power amplifier using advanced silicon germanium (SiGe) technology. The company says this process allows the HFA3983 power amplifier and detector to deliver improved performance while greatly reducing power consumption. The HFA3983 is one of four chips that comprise Intersil's next generation Prism II WLAN chipset.
The HFA3983 is a 2,4 GHz monolithic power amplifier designed to operate in the un-licensed ISM band. The device features two low-voltage single supply stages, delivering a minimum of +20,6 dBm of power at the 1 dB compression point. The resulting solution effectively delivers a 50% reduction in power consumption over Intersil's first-generation Prism WLAN chipset.
The HFA3983 is suited for a variety of wireless applications including wireless local area networks (WLANs), PCMCIA wireless transceivers, ISM systems including automatic level control (ALC) and TDMA packet protocol radios.
The device also includes a 2,4 GHz power detector with 15 dB of dynamic range and ±1 dB of accuracy. When used in conjunction with an external power sampler-coupling de-vice, an accurate ALC function can be implemented.
For further information about Intersil products contact
High reliability memories Altron Arrow
DSP, Micros & Memory
Infineon’s mil-temp memories offer a wide selection of volatile and non-volatile memories for applications that meet QML-Q certifications and offer support for mil-aero applications.
Read more...5G transparent antenna iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions recently announced the launch of its 5G transparent antenna, the YFCX001WWAH, an innovative solution designed to improve connectivity while maintaining seamless device design.
Read more...GNSS chipset for wearables RF Design
Telecoms, Datacoms, Wireless, IoT
The UBX-M10150-CC from u-blox is a GNSS chip that supports GPS, QZSS/SBAS, Galileo, and BeiDou constellations, and is designed for integration into wearable applications.
Read more...KIOXIA pioneer new 3D Flash technology EBV Electrolink
DSP, Micros & Memory
KIOXIA Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4,8 Gb/s NAND interface speed, superior power efficiency, and heightened density.
Read more...X-band radar RF Design
Editor's Choice Telecoms, Datacoms, Wireless, IoT
X-band radar systems, particularly those leveraging beamforming ICs (BFICs), advanced gallium nitride (GaN) and gallium arsenide (GaAs) components, are leading the way in providing the high-performance radar capabilities required for modern defence and surveillance.
Read more...Super-fast H.264 encoder FPGA core EBV Electrolink
DSP, Micros & Memory
An ITAR-compliant H.264 core designed for AMD FPGAs provides baseline H.264 support and is currently the smallest and fastest FPGA core in the industry.
Read more...Reference board for cardio monitoring Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The STDES-ESP01 reference board from STMicroelectronics demonstrates the capability of the ST1VAFE6AX and ST1VAFE3BX biosensors to detect ECG and SCG signals.
Read more...LTE Cat 1 bis communication iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The EG810M series is a series of LTE Cat 1 bis wireless communication modules specially designed by Quectel for M2M and IoT applications.
Read more...Quad-channel 16-bit converter RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
The ARF0468 from Advance RF is a quad-channel mixed-signal processing chip, with each channel comprising three major functional modules: ADC/DDC/DDS.