Telecoms, Datacoms, Wireless, IoT


'All-in-one' modem chip supports Caller ID, blacklisting, parallel phone detect

14 August 2002 Telecoms, Datacoms, Wireless, IoT

TDK Semiconductor has expanded significantly on its 'all-in-one' 73M2901 introduced in 1999 with the release of the new 73M2901CL, a 3,3 V single-chip modem that combines all the controller (DTE) and data pump functions necessary to implement an intelligent V.22bis data modem. The 73M2901CL feature-rich set includes critical functions like caller ID, blacklisting, parallel phone detect (line-in-use and parallel-pick-up/line-seize), long space disconnect, inactivity timeout and programmable call progress.

The 73M2901CL low-power modem IC has a significant portion of the modem circuit integrated on the chip, such as the microprocessor, DSP, analog front-end, and hybrid driver. The 3,3 V single chip architecture makes it physically small enough for the modular form factor, and virtually eliminates the need to specify hard-to-source passive components. The chip is based on TDK's implementation of the industry standard 8032 microcontroller core with a proprietary multiply and accumulate (MAC) coprocessor, analog front end, sigma-delta A/D and D/A. The ROM and RAM necessary to operate the modem are contained on the device. Additionally, the 73M2901CL provides an on-chip oscillator and hybrid driver. It is capable of data transmission and reception through 2400 bps. The chip consumes as little as 9,5 mA offering options for modem design from 2,7 to 3,6 V with optional internal hybrid and country specific call progress support.

The 73M2901CL single chip modem is available in 32-pin PLCC, 32-pin TQFP or a 44-pin LQFP package.



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