Clare's LITELINK III (CPC5620 and CPC5621) silicon phone line interface (PLI)/data access arrangement (DAA) is designed to enhance voice telephony performance. The LITELINK III is the first commercially available phone line interface IC designed specifically for both voice and high-speed data applications in the computer telephony market, claims Clare.
A single-package, all-silicon solution, it contains a unique on-chip optical isolation barrier which gives designers the ability to build telephone line interface circuits without bulky transformers. This allows them to simplify their design, gain greater channel density and lower the overall component count and development cost. LITELINK III is a superior solution to traditional transformer-based telephone line interfaces and competitive silicon DAA solutions with higher parts counts and PCB space requirements.
The CPC5620 (half-wave ring detect) and CPC5621 (full-wave ring detect) feature 3 V or 5 V operation, providing for an easy connection to high performance SLAC, CODEC and modem chipsets offered by leading OEMs. Because LITELINK III does not have complex set-up registers, it does not require the use of a controller for evaluation, testing and use.
Clare's distinctive design uses a new method of factory gain trim, eliminating the need for an on-board automatic gain control circuit and its attendant settling time. Other features of the design ensure low noise and low insertion loss, helping designers meet EIA/TIA 464 specifications for system loss. A mode pin has been added to simplify reactive termination applications such as in Europe and Australia.
LITELINK III is also backward compatible with Clare's previous LITELINK II solution - requiring only a change of 4 external resistors and the addition of a capacitor.
For more information contact Laetitia Prinsloo, Arrow Altech Distribution, 011 923 9600.
Converter power modules for 48 V networks Altron Arrow
Power Electronics / Power Management
The economic and quality-of-life benefits of electrification is driving the adoption of HV to 48 V DC-DC conversion across many markets with 48 V power modules becoming more common.
Read more...Memory for asset tracking Altron Arrow
DSP, Micros & Memory
The Page EEPROM, ST’s latest memory, has been designed for efficient datalogging and fast firmware upload/download in battery-operated devices.
Read more...Multiprotocol wireless SoC RF Design
Telecoms, Datacoms, Wireless, IoT
The nRF54LM20A from Nordic Semiconductor is a multiprotocol wireless System-on-Chip designed for demanding designs in Bluetooth devices.
Read more...High performance communication iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel’s FCS950R is a high-performance Wi-Fi 5 and Bluetooth 4.2 module that can deliver a maximum data rate up to 433,3 Mbps in 802.11ac mode.
Read more...Microchip and AVIVA Links collaboration Altron Arrow
News
Microchip and AVIVA Links have achieved groundbreaking ASA-ML interoperability, accelerating the shift to open standards for automotive connectivity.
Read more...Expanded STM32WL3x line for IoT sensors Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The STM32WL31x and STM32WL30x are more tailored versions of the STM32WL33x for designers who wish to focus on specific features, while lowering their bill of materials.
Read more...Full-band GNSS helical antenna RF Design
Telecoms, Datacoms, Wireless, IoT
A key feature of Calian’s HC3990XF antenna design is that it does not require a ground plane, making it ideal for size-constrained applications.
Read more...BLE and BT Mesh module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The HM-BT4531 from HOPERF is a BLE data transmission module that features an ARM Cortex-M0 32-bit processor.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.