Manufacturing / Production Technology, Hardware & Services


Higher efficiency heatsinking through extrusion

25 September 2002 Manufacturing / Production Technology, Hardware & Services

Significantly improved heat convection is possible with the use of the Pinbloc heatsink systems claims the manufacturer, Alutronic. The extrusion process, which has long been used for complex, sophisticated aluminium parts in the automobile industry, is now also available for component cooling applications in electronics.

In addition, the use of pure aluminium results in higher thermal conductivity of the basic material. By comparison, die-casting alloys (AlSiCu3) offer 150-160 W/mK, continuous casting alloys (AlMgSi0,5 ) offer 180-200 W/mK, while pure aluminium (AL99,0-99,9) offers 210-236 W/mK.

Additional improvement in thermal conductivity is achieved through production-related compression of the material in the direction of flow, and special production methods reduce assembly surface roughness to give lower thermal convection resistance. Large and compact surface designs are possible. 30% higher efficiency than comparable extruded heatsinks is achieved and 40% higher efficiency than comparable die-cast heatsinks.

Standard versions for PGAs and BGAs with the basic dimensions of 25 x 25 mm and 50 x 50 mm are available in various installed heights.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Electrolube helps smart homes become even smarter
31 August 2020, Vepac Electronics , Manufacturing / Production Technology, Hardware & Services
The Internet of Things (IoT) is a platform enabling embedded devices connected to the Internet to collect and exchange data with each other. Devices can begin to interact and work with each other, even ...

Read more...
Protective lacquer for electronic circuitry
31 August 2020, Vepac Electronics , Manufacturing / Production Technology, Hardware & Services
APL Acrylic Protective Lacquer is a flexible, fast-drying acrylic conformal coating used for the protection of electronic circuitry. It has been formulated for professional use only and meets the requirements ...

Read more...
Game over for lead?
31 August 2020, Techmet , Manufacturing / Production Technology, Hardware & Services
Lead is a unique material and is used in a wide range of applications. It has a high density making it ideal for ballast, is relatively ductile and easy to shape and has a low melting point which reduces ...

Read more...
Enclosures for mounting electronic applications
30 September 2020, Sivan Electronic Supplies , Enclosures, Racks, Cabinets & Panel Products
Available from Gainta is a range of plastic enclosures for mounting and assembly of general electronic applications. The bases of the cases have a mounting flange and incorporate a tongue and groove ...

Read more...
Free software for vibration feeder boosts robot flexibility
30 September 2020, Truth Electronic Manufacturing , Manufacturing / Production Technology, Hardware & Services
Yamaha Motor Europe’s Factory Automation section is giving customers extra power to boost the pick-and-place flexibility and productivity of their SCARA and cartesian robots by providing a free software ...

Read more...
Arc fusion fibre splicer
31 August 2020, IC Logistix , Manufacturing / Production Technology, Hardware & Services
The Fujikura-90S arc fusion splicer was recently launched in South Africa. This is the newest addition to the Fujikura range of splicers, replacing the 70S+ unit. The 90S can be utilised in any field ...

Read more...
Lead-free innovation for FPGA manufacture
31 August 2020, Test & Rework Solutions , Manufacturing / Production Technology, Hardware & Services
TopLine, represented locally by Test & Rework Solutions, announced that Martin Hart, CEO of TopLine and inventor, has filed for a US patent for a lead-free solder column used in the manufacture of field ...

Read more...
Lead-free innovation for FPGA manufacture
29 July 2020, Test & Rework Solutions , Manufacturing / Production Technology, Hardware & Services
TopLine, represented locally by Test & Rework Solutions, announced that Martin Hart, CEO of TopLine and inventor, has filed for a US patent for a lead-free solder column used in the manufacture of field ...

Read more...
Arc fusion fibre splicer
29 July 2020, IC Logistix , Manufacturing / Production Technology, Hardware & Services
The Fujikura-90S arc fusion splicer was recently launched in South Africa. This is the newest addition to the Fujikura range of splicers, replacing the 70S+ unit. The 90S can be utilised in any field ...

Read more...
The powerful impact of protecting future LED lighting applications
29 July 2020, Vepac Electronics , Manufacturing / Production Technology, Hardware & Services
The importance of electro-chemical products and their ability to protect LEDs and associated products from adverse environmental conditions, while at the same time ensuring efficient heat dissipation from these components.

Read more...