Flash memory with advanced security features for vehicle environments
6 November 2002
DSP, Micros & Memory
AMD is sampling what it claims is the industry's fastest Flash memory device designed to operate in demanding, high-temperature automotive environments. The Am29BDD160, a 16 Mb device, is designed to meet stringent demands for performance and reliability and is highly suited for applications in advanced automotive systems, including power-train management, high-end engine control modules, and anti-lock brake systems (ABS).
The device also delivers up to 33% faster access and up to 65% more data throughput than industry standard devices, according to the manufacturer. It is also the industry's only 66 MHz device that can function over a temperature range of -40 to +145°C. Enabling an automotive 'black box' data recovery type functionality, the device also features AMD's award-winning Simultaneous Read/Write architecture, which allows the system to read and program data at the same time without any latency.
AMD says that the new Flash memory device features 'Advanced Sector Protection Architecture'. This helps protect customers' valuable engine code and data against hackers who could seriously compromise the safety and performance of an automobile. The architecture includes the option of using a 64-bit password to defend any or all engine-control codes and data against unauthorised modification.
Further reading:
Memory for asset tracking
Altron Arrow
DSP, Micros & Memory
The Page EEPROM, ST’s latest memory, has been designed for efficient datalogging and fast firmware upload/download in battery-operated devices.
Read more...
Engineered for high-reliability applications
Future Electronics
DSP, Micros & Memory
The MCX E series of Arm Cortex-M4F and Arm Cortex-M7 microcontrollers from NXP are engineered for demanding industrial and IoT environments.
Read more...
NXP’s development platform guide
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...
XJTAG launches two new Flash programmers
ASIC Design Services
DSP, Micros & Memory
XJTAG has announced XJExpress and XJExpress-FPGA, a pair of Flash programmers perfect for development, debug and in-service applications.
Read more...
Processor offers competitive solution for advanced HMIs
Future Electronics
DSP, Micros & Memory
The new RZ/A3M microprocessor from Renesas features 128 Mbytes of fast DDR3L DRAM memory for system cost reduction, and supports
1280 x 800 px video resolution at a rate of 30 frames/s.
Read more...
ESP32-C6 achieves PSA-L2
iCorp Technologies
DSP, Micros & Memory
Espressif Systems recently announced that its ESP32-C6 microcontroller has achieved PSA Certified Level 2 (PSA-L2) security certification, making it the first RISC-V-based MCU to reach this level.
Read more...
Microprocessor with integrated NPU
Avnet Silica
DSP, Micros & Memory
The RZ/G3E from Renesas is a microprocessor integrated with quad CPU and NPU in one chip, improving power efficiency, reliability, and security.
Read more...
Nordic Semiconductor launches nRF Connect SDK Bare Metal option for nRF54L series
Avnet Silica
DSP, Micros & Memory
This is a new, RTOS-independent software solution for Bluetooth LE development, designed to ease developers’ migration from the legacy nRF5 SDK and nRF52 series to the next-generation nRF54L series.
Read more...
Dual-core support in NECTO Studio
DSP, Micros & Memory
MIKROE recently announced that version 7.3.0 of its NECTO Studio Integrated Development Environment now supports dual-core MCUs, allowing designers to program and debug each core independently.
Read more...
Post Quantum Cryptographic firmware library
DSP, Micros & Memory
The STM32 post-quantum cryptographic library enables developers to satisfy application requirements for any combination of data integrity, confidentiality, identification/authentication, and nonrepudiation.
Read more...