Electronics Technology


Higher efficiency heatsinking through extrusion

20 November 2002 Electronics Technology

Significantly improved heat convection is possible with the use of the Pinbloc heatsink systems claims the manufacturer, Alutronic. The extrusion process, which has long been used for complex, sophisticated aluminium parts in the automobile industry, is now also available for component cooling applications in electronics.

In addition, the use of pure aluminium results in higher thermal conductivity of the basic material. By comparison, die-casting alloys (AlSiCu3) offer 150-160 W/mK, continuous casting alloys (AlMgSi0,5 ) offer 180-200 W/mK, while pure aluminium (AL99,0-99,9) offers 210-236 W/mK.

Additional improvement in thermal conductivity is achieved through production-related compression of the material in the direction of flow, and special production methods reduce assembly surface roughness to give lower thermal convection resistance. Large and compact surface designs are possible. 30% higher efficiency than comparable extruded heatsinks is achieved and 40% higher efficiency than comparable die-cast heatsinks.

Standard versions for PGAs and BGAs with the basic dimensions of 25 x 25 mm and 50 x 50 mm are available in various installed heights.



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