SST has announced a new packaging solution that it says will enable the company to deliver a wide range of flash products in the industry's smallest and thinnest form factors. Available in 4 x 6 mm, 48-contact footprints, SST's new Micro-Package offerings include a 0,73 mm-height Ball Grid Array and a 0,52 mm-height Land Grid Array form factor. Both Micro-Packages have been optimised for space-restricted applications such as Bluetooth modules and mobile devices. According to SST, the new lightweight Micro-Packages provide the thinnest flash packages and, in most densities, also the smallest platform size available in the flash industry today.
SST was able to achieve this flexibility by combining its power- and size-efficient SuperFlash technology with state-of-the-art packaging technologies. SST's WSON package (ultra-thin, small outline package), announced in August of this year, also offers similar attributes, but for devices with low pin counts.
Coming on the heels of the WSON package, the new Micro-Package offering includes two variants: a Ball Grid Array package (WFBGA) as well as a Land Grid Array (XFLGA). The two Micro-Packages are identical in every regard except that the WFBGA, with a maximum height of 0,73 mm, has BGA-style balls; the XFLGA, with a maximum height of 0,52 mm, has solder lands, or bumps. Occupying 24 mm2 of board space, the Micro-Package solutions are 50% smaller than even SST's industry-leading 6 x 8 mm BGA packages. In addition, SST's Micro-Packages both have the same 0,5 mm contact pitch and the same pin outs spanning all the way from 1 to 32 Mb, and offered in both 3,3 and 1,8 V versions.
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