All members of Clare's line card access switch (LCAS) family are now offered in space-saving micro leadframe packages (MLP). Designers can now achieve new benchmarks in line density and realise system cost savings for both traditional voice and integrated voice-data (IVD) line cards found in central office (CO) and digital loop carrier (DLC) communications equipment.
The MLP is a near chip scale package (CSP) that offers line card designers significant area savings compared to traditional package types. It is a leadless package where electrical connections are made through lands on the bottom surface of the component. Compared to the 191 mm2 area of the CPC7583 product in a 28-pin SOIC package, the 28-pin MLP version has a footprint of only 77 mm2. This translates to an area savings of 60%. In addition, the small height of the MLP at only 0,9 mm offers a 65% reduction and gives designers the freedom to place parts on the back side of circuit boards.
Since the CPC7583 replaces three 2-Form-C electromechanical relays (EMRs), the area comparisons are equally dramatic. Even when compared to fourth generation EMRs, the MLP offers a 65% reduction in area and an 80% reduction in height. This represents another key advantage for silicon solutions in addition to lower power, improved reliability, improved airflow and reduced impulse noise.
Clare's families of LCAS products have low, matched on-resistance enabling high longitudinal balance, integrated zero-cross switching to reduce impulse noise, ultra-low power consumption of 10 mW and tertiary protection features including current limiting, thermal shutdown and SLIC protection.
For more information contact Les Bidgood, Arrow Altech Distribution, 011 923 9600, [email protected]
Wi-Fi 6/BLE module enables rapid development Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the WE310K6, a fully integrated, low-power module featuring dual-band, dual-stream Wi-Fi 6, and dual-mode Bluetooth/BLE.
Read more...Low phase noise amplifier RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
The MAAL-011158 from Macom is an easy-to-use low-phase noise amplifier that provides 12 dB of gain in a 32-lead QFN plastic package.
Read more...Full sensor to cloud solution CST Electronics
Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.
Read more...Analysis of switch-mode power supply: inductor violations Altron Arrow
Editor's Choice Power Electronics / Power Management
Common switch-mode power supply (SMPS) design errors are discussed, and their appropriate rectification is specified, with details on complications that arise with the power stage design of DC-DC switching regulators.
Read more...Microsoft Windows IoT on ARM Altron Arrow
Computer/Embedded Technology
This expansion means that the Windows IoT ecosystem can now harness the power of ARM processors, known for their energy efficiency and versatility.
Read more...Long-range Wi-Fi HaLow module TRX Electronics
Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.
Read more...Quectel launches 3GPP NTN comms module Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.
Read more...SIMCom’s A7673x series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.
printer friendly version