Precision X-ray imaging for BGA, Flip Chip, CSP, IC inspection
26 February 2003
Manufacturing / Production Technology, Hardware & Services
Glenbrook Technologies' 'Jewel Box' is a realtime X-ray inspection system claimed to deliver superior image quality for laboratory and failure analysis applications.
The system's high-resolution X-ray camera and 10 micron MicroTech X-ray source provide magnification from 15X up to 500X, with resolution of 100 line pairs/mm. The progressive magnification facility allows inspection of multiple details.
With these advanced capabilities, according to the manufacturer, the desktop-mountable Jewel Box produces images comparable to those from X-ray inspection systems that are 10 times larger in size, and five times higher in cost.
Sample images of defects as viewed on the Jewel Box are shown in Figures 1-4.
Figure 1. Image of a surface mounted IC permits inspection of the wires within the IC and the solder joint quality of the leads, revealing insufficient solder on right-most lead
Figure 2. Image of a micro BGA, rotated, reveals wire sweeps and solder ball shape
Figure 3. Solder joints on a flip chip: note large number of voids in each joint and bridging at the left side
Figure 4. Die attach, showing voids in epoxy connecting the silicon to the metal lead frame
In addition to generating high-quality images of solder joints and bonds in advanced technology packages that cannot be verified by visual inspection, the Jewel Box has the sensitivity to inspect soft materials, such as moulded plastics and encapsulants, as easily as components and electronic assemblies, says Glenbrook. The transparent enclosure on all four sides of the Jewel Box also allows easy viewing from any angle. The positioner features five-axis control, including 360° rotation and tilt. The quadratic proportional controller ensures precision control over the full range of positioning speeds.
The Jewel Box employs Glenbrook's patented, award-winning X-ray camera technology. The image processor's capabilities include: image sharpening, contrast adjustment, four-image memory, percentage of voids, plus on-screen measurement and labelling.
The system has a compact footprint (686 x 737 mm and 762 mm high) and may be placed on a desk or countertop, or mounted on an optional wheeled cabinet base. The anode voltage and currrent is 70 kV and 100 µA respectively (both adjustable), while focal spot size is 10 microns.
For more information contact Hawker Richardson, 011 792 2766.
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