Rework system offers the accuracy and control essential for new array packages
26 February 2003Manufacturing / Production Technology, Hardware & Services
Metcal claims its versatile APR-5000 Array Package Rework System offers the repeatability, accuracy and thermal control essential for the safe and effective rework of today's leading-edge BGA, CSP, land grid array (LGA), micro SMD, micro-lead frame (MLF) and bumped chip component packages.
Capable of handling boards up to 229 x 254 mm with a placement accuracy to 0,025 mm and interconnection pitches as low as 0,3 mm, the APR-5000 Array Package Rework System is ideal for reworking smaller PCBs such as cellphones and laptop computers. When working with such assemblies - characterised by small, odd shaped boards and advanced packages - the APR-5000 Array Package Rework System can deliver the required high-end performance at a very competitive cost, says the manufacturer.
The APR-5000 is the first of a new range of Metcal Array Rework Systems that address the specific demands of very different market segments, moving away from the 'one machine fits all' approach adopted by many rework system manufacturers. It incorporates Metcal's exclusive integral vision system that simplifies accurate component placement. This allows operators to simultaneously view the topside of the PCB and a superimposed image of the underside of the component. With micrometer adjustment, images can be accurately aligned in the X, Y & Theta axes prior to placement. In addition, adds Metcal, integrating the vision system with the APR-5000's software eliminates the need for multiple monitors, fully optimising bench space.
As with production reflow technology, the APR-5000 system uses low airflow forced convection heating. Metcal says that its patented reflow head delivers temperature uniformity, ensuring safe and simultaneous reflow of the component being removed without disruption to adjacent parts.
Closed-loop, computer-controlled parameters of time, temperature and airflow guarantee process repeatability and precision. User-friendly software controls the five stages of the reflow profile: preheat, soak, ramp, reflow and cooling. In addition, board temperature can be monitored using the APR-5000's three integrated flying thermocouples, and realtime adjustment can be made to all parameters while the profile is running. The software is designed to be both instructive and intuitive - walking the engineer through the steps of process development and then instructing the operator to ensure consistent execution of the automatic profile functions.
To guarantee greater temperature uniformity, the PCB itself is centralised relative to the pre-heater - a design feature unique to the APR-5000 Array Package Rework System. The system even addresses future process demands, with sufficient power to meet the higher temperatures required for 'Lead Free' assemblies. A key feature is an integrated placement and reflow head that moves to the correct position for rework, eliminating the need for PCB movement during the process.
The APR-5000 uses only 480 x 760 mm bench space. Because the system requires no special wiring and uses self-contained pumps, it can be moved to another bench with no need for fitting or plumbing.
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