Interconnection


High density interconnects offer choice of board spacing and termination

12 March 2003 Interconnection

Samtec high density four-row surface-mount FourRay headers and sockets (TOLC and SOLC Series) provide up to 200 I/Os in less than or 6,54 sq cm. Board stack height choices are 6,35, 8, 10 and 12 mm. The unique Samtec socket construction on the SOLC series features high retention, cost-effective, tuning-fork style Tiger Buy contacts. The TOLC/SOLC Series are available in pin counts from five to 50 positions per row in multiples of five. Other lead counts are available.

For through-hole four-row applications on 1,27 mm pitch, Samtec's precision-formed FourRay socket and terminal sets (MOLC and FOLC Series) are available. The unique socket construction on the FOLC series features high reliability, three-finger Beryllium Copper Tiger-Eye contacts.

For more information contact Bradley Richards, Spectrum Concepts, 011 395 3184, specbrad@iafrica.com



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