Interconnection


10 Gbps board-to-board mezzanine connector

26 March 2003 Interconnection

Providing high-speed differential and single-ended electrical connection between parallel mounted PCBs, FCI's GIG-array mezzanine connector handles signal data rates up to 10 Gbps. This high-density BGA receptacle and plug system accommodates up to 392 signals per connector.

Consistent high-speed performance is assured by the GIG-array connector's 100 Ω differential pair matched impedance design. The resulting cross-talk performance of less than 2% ensures signal integrity is maintained across the signal frequency range. Multiple stack heights ranging from 15 mm to 35 mm and connector sizes supporting between 104 to 392 signals means it provides increased flexibility in high-density mezzanine design. The BGA interface's staggered pitch of 1 mm x 0,65 mm helps optimise routing and electrical performance, reduce board size and simplify the soldering process.

By incorporating dedicated ground contacts to provide impedance matching and ensure low cross-talk, GIG-Array connectors free the signal contacts for simple configuration in either differential (100 Ω) or single ended (50 Ω) modes. As each signal has two separate points of contact, product reliability is also enhanced.

To ensure proper mating, plugs and receptacles are keyed at the A1 end, clearly identified by laser etching. To smooth initial alignment the plug housing features a chamfered lead-in to capture and guide the receptacle. Contacts are high strength copper alloy plated Au over Ni, current rating is 1 A per contact.

The GIG-Array connector suits high-speed high-density telecom applications including transmission, access, switching, optics and networking products, data storage and other applications requiring 10 Gbps performance. For ease of assembly, an optional pick-up cap is available for vacuum pick-up and automated SMT placement.





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