Telecoms, Datacoms, Wireless, IoT


Review of Class AB high-power amplifiers

25 March 2020 Telecoms, Datacoms, Wireless, IoT

A Class AB amplifier is a highly used amplifier design for high-power RF applications, as well as other applications that require high power gain with minimal signal distortion.

The main benefit is that Class AB amplifiers are biased so that the output current flows for less than one full cycle of the input waveform, but for more than a half cycle of the waveform. An AB amplifier design allows for the multiple switching transistors in the complementary output stage to conduct an opposite half-cycle of the input waveform prior to combination at load.

This design results in minimised crossover distortion, in contrast to that of the Class B amplifier design, as both output transistors conduct for a short period of time each cycle during the zero crossover period. Hence, AB amplifiers have a conduction angle greater than 180 degrees and smaller than 360 degrees.

The benefit of this design is a much more efficient amplifier than a Class A amplifier, but which delivers better signal quality than a Class B amplifier, albeit less efficiently. With good bias control, the distortion associated with partial conduction amplifiers can be minimised in Class AB configurations.

In the case of RF amplification, Class AB amplifiers with excellent efficiency can be designed that have extremely wide bandwidths, high gain and high saturated output power levels. Class AB high-power amplifiers (HPAs) that reach 18 GHz are available with saturated power output levels reaching 10 Watts to 200 Watts. Depending on the technology, available Class AB HPAs can reach power added efficiency (PAE) of 40%.

Power level gains for these types of amplifiers range from 37 dB to 53 dB. Additionally, these amplifiers also often feature DC bias control, which is sometimes TTL logic controlled. Added features include current and temperature sensing functions for better bias compensation and monitoring, as well as heatsink enclosures with the ability to add cooling fans for better thermal management.

There are several common semiconductor technologies used to fabricate Class AB HPAs: vertically diffused metal oxide semiconductor (VDMOS), laterally diffused metal oxide semiconductor (LDMOS) and gallium nitride (GaN) transistors.

Essentially, the type of semiconductor technology used for a Class AB HPA depends on the frequency range of the amplifier. VDMOS HPAs generally operate efficiently below a few hundred megahertz, while LDMOS HPAs can be designed to be efficient to a few gigahertz, but are generally more efficient below one gigahertz. GaN HPAs, on the other hand, can be designed for applications in the tens of gigahertz with extremely high efficiency and gain, even at higher frequencies.

HPAs also feature various coaxial connector styles depending on the power and frequency of the amplifier. For HPAs that operate to several gigahertz, both SMA and N-type connectors are common, with N-type connectors being able to handle higher power than SMA. However, for higher-frequency applications beyond 10 GHz and below 200 Watts of power, SMAs are the most prevalent coaxial connector.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Wi-Fi 6 and Bluetooth LE co-processor
Altron Arrow Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released its ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE combo co-processor module.

Read more...
Improving accuracy of outdoor devices
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
In a real-world environment, accessing a direct satellite signal is not always possible, and it cannot be relied upon as the only solution to provide a device with accurate location at all times.

Read more...
New 3dB hybrid couplers
Electrocomp Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.

Read more...
Next-level Software Defined Radio
IOT Electronics Telecoms, Datacoms, Wireless, IoT
Great Scott Gadgets has announced the HackRF Pro, a powerful evolution of its popular Software Defined Radio (SDR) platform designed for engineers and enthusiasts.

Read more...
High-performance Zigbee and BLE module
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
The KCMA32S from Quectel boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports Zigbee 3.0, BLE 5.3 and BLE mesh.

Read more...
Championing local PCB manufacturing
Master Circuits Telecoms, Datacoms, Wireless, IoT
Master Circuits, founded in 1994 by Peter Frankish in Durban, was born from the vision to meet the growing local demand for quick-turnaround printed circuit boards in South Africa.

Read more...
How IoT-driven smart data helps businesses stay ahead
Trinity IoT Telecoms, Datacoms, Wireless, IoT
With around 19 billion IoT devices globally, embedded in everything from machinery to vehicles to consumer products, reliable data is plentiful.

Read more...
IoT-optimised LTE Cat 1 bis module
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Quectel’s EG915K-EU is an LTE Cat 1 bis wireless communication module specially designed for M2M and IoT applications.

Read more...
Chip provides concurrent dual connectivity
EBV Electrolink Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.

Read more...
Nordic Semiconductor acquires Memfault
RF Design News
With this acquisition, Nordic has launched its first complete chip-to-cloud platform for lifecycle management of connected products.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved