RF electromechanical switches are a key active device in many signal chains, including time-domain duplex communications and pulsed radar applications. Such switches can be as simple as a 3-port toggle switch, or single-pole double-throw, or more complicated such as double-pull switches or single-pole switches with more than 10 poles.
A main benefit of electromechanical switch technology is that they can be built using high-quality mechanical components and conductors that limit the insertion loss through the switch and can handle higher power levels compared to other switch technologies. However, electromechanical switches are not as fast as active switches (PIN diode or solid-state switches) or microelectromechanical machine (MEMS) switches.
Hence, RF electromechanical switches are better suited to some applications over others. Given the high isolation, low insertion loss, and high power handling of these types of RF switches, they are well suited to any application that requires optimising these parameters and can operate with switching times limited by the electromechanical relays. Moreover, electromechanical RF switches tend to be larger and heavier than other RF switch technologies and require more control signal power (actuating power) to switch. Therefore, electromechanical RF switches are more often packaged in coaxial or waveguide assemblies as opposed to surface mount or fully integrated options.
The metal-to-metal contact of these switches does allow for extremely high bandwidths, and the size of electromechanical switches can be a function of the frequency range of these devices. Though at very high frequencies the tolerances of machining the electromagnetic relays becomes infeasible and technologies such as MEMS or solid-state relays are more fitting. These metallic contacts also wear over time, and an electromagnetic RF relay is typically specified to operate along datasheet specification for a set amount of actuation cycles. The lifespan of these switches could range from hundreds of thousands of cycles to several million depending on the quality of the switch design and materials.
Depending on the design of the electromagnetic relay, such an RF switch may also have an extremely wide operating range compared to other switch technologies. Certain of these switch designs also conform to military standards for ruggedness and reliability, which makes electromagnetic switches better suited to high reliability (Hi-Rel) applications, such as military, land-mobile vehicle, aerospace, and naval.
Wireless connectivity expanded iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has introduced two new members of its ESP32 wireless SoC family: the ESP32-E22, the company’s first Wi-Fi 6E connectivity chip, and the ESP32-H21, an ultra-low-power Bluetooth LE microcontroller aimed at coin-cell and battery-powered devices.
Read more...Integrated X-band radar front-end module RF Design
Telecoms, Datacoms, Wireless, IoT
Qorvo has introduced an X-band radar front-end solution that enables defence system designers to achieve higher performance without increasing size, weight or prime power.
Read more...Introducing Aurata CST Electronics
Telecoms, Datacoms, Wireless, IoT
Antenova has launched Aurata SR4L112: a compact, high efficiency embedded 4G/LTE antenna engineered for long, narrow PCB designs.
Read more...Multi-constellation GNSS module in a legacy-compatible footprint Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.
Read more...Quectel expands 5G portfolio iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel expands 5G portfolio with new Qualcomm- and UNISOC-based modules.
Read more...Surface mount power amplifier for high-power applications RF Design
Power Electronics / Power Management
The GNA-63-5W+, from Mini-Circuits, is a GaN MMIC Power Amplifier (PA) designed for demanding RF applications requiring high efficiency, excellent linearity, and a compact footprint.
Read more...Compact RTK design: More than just the receiver iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
In practice, engineers building compact RTK products keep discovering the same thing: the hardest component in the system is no longer the receiver. It is the antenna.
Read more...Microchip advances Space-Grade timing performance ASIC Design Services
Telecoms, Datacoms, Wireless, IoT
Microchip Technology has expanded its atomic clock portfolio with the radiation-tolerant Space CSAC-SA65, a Chip Scale Atomic Clock designed to deliver precise timing for space systems.
Read more...Channel emulator for 6 G and Wi-Fi 7/8 Concilium Technologies
Telecoms, Datacoms, Wireless, IoT
With 400 MHz instantaneous bandwidth and support for carrier frequencies up to 23,6 GHz, Vertex 6.0 is the industry’s first channel emulator designed for next generation 6 G and Wi-Fi 7/8 testing.
Read more...Secure, low-power Bluetooth LE SoC NuVision Electronics
Telecoms, Datacoms, Wireless, IoT
Silicon Labs unveils BG2B, its lowest-power Bluetooth LE SoC with industry-leading power efficiency, security, and integration.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.