Telecoms, Datacoms, Wireless, IoT


3G/4G/5G power amplifier module

26 May 2021 Telecoms, Datacoms, Wireless, IoT

The OM9902-11 is a Phase 5N power amplifier module (PAM) that supports 3G/4G/5G NR handsets and operates efficiently in CDMA, WCDMA, TD-SCDMA and LTE/NR modes. The module, which is made by OnMicro, is fully programmable through a MIPI interface.

The PAM consists of 3G/4G/5G PA blocks for low, high and mid bands, a multi-function control (MFC) block and RF input/output ports internally matched to 50 Ω to reduce the number of external components. A CMOS integrated circuit uses standard MIPI control to provide the internal MFC interface and operation. Extremely low leakage current maximises handset standby time. The device is packaged in a small LGA package (4,0 x 6,8 x 0,75 mm).


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Quectel’s single-board computers put industrial edge computing on one PCB
iCorp Technologies Computer/Embedded Technology
Quectel Pi series of single-board computers (SBCs), designed for a broad range of industrial applications, include three compact development platforms – the Quectel Pi M1, L1, and H1 boards.

Read more...
Simplifying system design
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
The FGMC63N tri-band MCU Wi-Fi 6E module from Quectel addresses offers integrated connectivity across 2,4 GHz, 5 GHz, and 6 GHz bands in a compact, highly optimised design.

Read more...
Dragino’s connectivity catalogue
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
Where Wi-Fi demands frequent charging and covers tens of meters, and traditional cellular consumes too much power for battery-operated nodes, LoRaWAN threads the needle.

Read more...
RF filters explained
RFiber Solutions Telecoms, Datacoms, Wireless, IoT
As RF environments become increasingly crowded, RF filters play a critical role in maintaining signal quality, improving system performance, and ensuring reliable operation.

Read more...
Practical design strategies for 5G
RF Design Telecoms, Datacoms, Wireless, IoT
The Cavli CQM211 aims to provide a platform that combines strong 5G connectivity with onboard compute capability, as well as interface flexibility that suits both new designs and rapid migrations from earlier products.

Read more...
Low-power memory born for edge AI
iCorp Technologies DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.

Read more...
GigaDevice expands optical communication portfolio
NuVision Electronics Telecoms, Datacoms, Wireless, IoT
GigaDevice has introduced the new GD32E512 and GD32E252 series MCUs specifically designed for optical module applications.

Read more...
Next-gen smart module powers intelligence at the edge
iCorp Technologies DSP, Micros & Memory
Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.

Read more...
An industry-first Android 16 smart module solution
RF Design Computer/Embedded Technology Telecoms, Datacoms, Wireless, IoT
The MeiG Smart SLM580 4G Smart Module features native support for Android 16 and covers core frequency bands in major countries and regions worldwide.

Read more...
Compact MCU for IoT endpoints
iCorp Technologies DSP, Micros & Memory
Quectel’s FCM266D combines single-band 2,4 GHz Wi-Fi 6 with Bluetooth LE 5.4 in an ultra-compact LCC package measuring just 20 x 18 x 2,4 mm.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved