Hybrid placement machine for components and wafers
25 August 2021Manufacturing / Production Technology, Hardware & Services
Recently released by Yamaha Motor Europe is the new i-Cube10 (YRH10) hybrid placer, which has both surface mounter functions for electronic components and a die bonder for wafer components.
The machine was developed as the successor to the long-selling i-CubeIID (YHP-2D), known for its space-saving design as well as productivity and versatility with its hybrid placer for device assembly and a wafer feed unit as standard equipment. The new i-Cube10 (YRH10) retains the same high processing compatibility suiting a wide range of electronic components and semiconductor packages, but boasts 50% higher production capability and mounting accuracy, achieving a bare chip mounting speed of 10 800 components per hour from wafer supply and a mounting accuracy of ±15 μm.
Main features include:
• High-speed productivity by optimising recognition camera operations for the mounting head and wafers, component recognition via the head-mounted scan camera, the adoption of a 10-unit multi-nozzle mounting head and accelerated wafer swaps; and improved mounting accuracy by adopting a high-rigidity conveyor, axis control optimisation, a heat compensation feature and more,
• High versatility that allows for mounting of surface mount devices (SMD) as well as wafer components with a single unit.
• User-friendly features such as a wafer pickup condition setup utility that can optically set conditions for wafer parts, a newly developed user interface with improved usability and a feeder unit capacity twice that of previous models.
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