MikroElektronika has launched LTE IoT 8 Click – a member of its 1000-strong Click family of peripheral development boards – targeting designers of low-power LTE-M and NB-IoT connectivity solutions in wearables, asset tracking, industrial monitoring and smart metering.
LTE IoT 8 Click is a compact add-on board that features the SKY66430-11, a multi-band, multi-chip system-in-package (SiP) supporting 5G Massive IoT (LTE-M/NB-IoT) platforms from Skyworks Solutions and Sequans Communications. The pre-certified SiP integrates the entire RF front end, transceiver, power management, memory and baseband modem for an LTE multi-band radio operating in the 698-2200 MHz frequency range.
Click boards are based on the 16-pin mikroBUS standard for sockets on a development board invented by MikroElektronika 10 years ago. Click boards enable design engineers to change peripherals easily, potentially cutting development time significantly. The company releases a new Click board nearly every day and many leading microcontroller companies including Microchip Technology, NXP Semiconductors, Infineon Technologies, Dialog Semiconductor, STMicroelectronics, Analog Devices, Renesas Electronics and Toshiba now include the mikroBUS socket on their development boards.
LTE IoT 8 Click is supported by a mikroSDK compliant library which includes functions that simplify software development. This Click board comes as a fully tested product, ready to be used on any system equipped with the mikroBUS socket.
Full sensor to cloud solution CST Electronics
Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.
Read more...Long-range Wi-Fi HaLow module TRX Electronics
Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.
Read more...Quectel launches 3GPP NTN comms module Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.
Read more...SIMCom’s A7673x series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.
Read more...Long-range connectivity module Avnet Silica
Telecoms, Datacoms, Wireless, IoT
Digi XBee XR 868 RF Modules support the deployment of long-range connectivity applications, and support point-to-point and mesh networking protocols.
Read more...4G LTE-M/NB-IoT connectivity reference design iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Developed around the industry-leading Nordic nRF9160 module, the platform comes complete with a newly-developed LTE antenna, ATRIA, which is pre-certified to operate over the full LTE-M and NB-IoT bands.
Read more...Antennas to meet all connectivity requirements Electrocomp
Telecoms, Datacoms, Wireless, IoT
Kyocera AVX RF antennas meet today’s connectivity demands in the LTE, Wi-Fi, Bluetooth, GNSS, and ISM wireless bands, available in surface mount, patch or external configurations.
Read more...Introducing SIMCom’s new A7673X series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat 1 bis module that supports LTE-FDD, with a maximum downlink rate of 10 Mbps and an uplink rate of 5 Mbps.
Read more...18 W monolithic microwave amplifier RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
The CHA8612-QDB is a two stage, high-power amplifier operating between 7,9 and 11 GHz. The monolithic microwave amplifier can typically provide 18 W of saturated output power and 40% of power-added efficiency.
printer friendly version