MikroElektronika has launched LTE IoT 8 Click – a member of its 1000-strong Click family of peripheral development boards – targeting designers of low-power LTE-M and NB-IoT connectivity solutions in wearables, asset tracking, industrial monitoring and smart metering.
LTE IoT 8 Click is a compact add-on board that features the SKY66430-11, a multi-band, multi-chip system-in-package (SiP) supporting 5G Massive IoT (LTE-M/NB-IoT) platforms from Skyworks Solutions and Sequans Communications. The pre-certified SiP integrates the entire RF front end, transceiver, power management, memory and baseband modem for an LTE multi-band radio operating in the 698-2200 MHz frequency range.
Click boards are based on the 16-pin mikroBUS standard for sockets on a development board invented by MikroElektronika 10 years ago. Click boards enable design engineers to change peripherals easily, potentially cutting development time significantly. The company releases a new Click board nearly every day and many leading microcontroller companies including Microchip Technology, NXP Semiconductors, Infineon Technologies, Dialog Semiconductor, STMicroelectronics, Analog Devices, Renesas Electronics and Toshiba now include the mikroBUS socket on their development boards.
LTE IoT 8 Click is supported by a mikroSDK compliant library which includes functions that simplify software development. This Click board comes as a fully tested product, ready to be used on any system equipped with the mikroBUS socket.
Wi-Fi 6 and Bluetooth LE co-processor Altron Arrow
Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released its ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE combo co-processor module.
Read more...Improving accuracy of outdoor devices iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
In a real-world environment, accessing a direct satellite signal is not always possible, and it cannot be relied upon as the only solution to provide a device with accurate location at all times.
Read more...New 3dB hybrid couplers Electrocomp
Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.
Read more...Next-level Software Defined Radio IOT Electronics
Telecoms, Datacoms, Wireless, IoT
Great Scott Gadgets has announced the HackRF Pro, a powerful evolution of its popular Software Defined Radio (SDR) platform designed for engineers and enthusiasts.
Read more...High-performance Zigbee and BLE module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The KCMA32S from Quectel boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports Zigbee 3.0, BLE 5.3 and BLE mesh.
Read more...Championing local PCB manufacturing Master Circuits
Telecoms, Datacoms, Wireless, IoT
Master Circuits, founded in 1994 by Peter Frankish in Durban, was born from the vision to meet the growing local demand for quick-turnaround printed circuit boards in South Africa.
Read more...IoT-optimised LTE Cat 1 bis module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel’s EG915K-EU is an LTE Cat 1 bis wireless communication module specially designed for M2M and IoT applications.
Read more...Chip provides concurrent dual connectivity EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.
Read more...The 6 GHz band radio solution Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Analog Devices’ 16 nm transceiver family offers a highly integrated solution for this new frequency band, featuring low power consumption and high performance.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.