NXP Semiconductors has announced the expansion of its NXP EdgeReady solution portfolio, adding a solution for secure face recognition that leverages a high-performance 3D structured light module (SLM) camera combined with the i.MX RT117F crossover MCU.
This is the first solution to combine a 3D SLM camera with an MCU to deliver the performance and security of 3D face recognition at the edge, thereby removing the need to use an expensive and power-hungry Linux implementation on an MPU, as is traditionally required with high-performance 3D cameras.
The newest EdgeReady solution enables developers of smart locks and other access control systems to add machine learning-based secure face recognition quickly and easily to smart home and smart building products. The solution delivers reliable 3D face recognition in indoor and outdoor applications, across varied lighting conditions including bright sunlight, dim night light, or other difficult lighting conditions that are challenging for traditional face recognition systems.
The use of a 3D SLM camera enables advanced liveness detection, helping to distinguish a real person from spoofing techniques such as a photograph, imitator mask or a 3D model, to prevent unauthorised access.
The i.MX RT117F utilises an advanced machine learning model as part of NXP’s eIQ machine learning software running on its high-performance CPU core that enables faster and accurate face recognition to improve both the user experience and power efficiency.
Similar to the i.MX RT106F MCU-based NXP EdgeReady solution for secure face recognition, advanced liveness detection and face recognition are all done locally at the edge, making it possible for personal biometric data to remain on the device. This helps address consumer privacy concerns while also eliminating the latency associated with cloud-based solutions.
Part of the i.MX RT1170 family of crossover MCUs, the i.MX RT117F is based on an Arm Cortex-M7 CPU with 2 MB of on-chip SRAM and running at up to 1 GHz. The i.MX RT117F includes a licence to use the NXP 3D face recognition software development kit (SDK) and is available in consumer, industrial and automotive temperature grades.
High performance SDR design considerations RFiber Solutions
Editor's Choice DSP, Micros & Memory
As the spectrum gets increasingly crowded, and adversaries more capable, the task of examining wide bands and making sense of it all, while not missing anything, gets harder.
Read more...Direct RF converters and FPGAs boost EW applications RFiber Solutions
DSP, Micros & Memory
The latest boost to electronic warfare designs comes from emerging FPGA architectures that combine advanced RF converters and high-performance processing engines in a single package.
Read more...1-Wire EEPROM with secure authenticator Altron Arrow
DSP, Micros & Memory
The DS28E54 secure authenticator combines FIPS 202-compliant secure hash algorithm (SHA-3) challenge and response authentication with secured electrically erasable programmable read-only memory.
Read more...Chip provides concurrent dual connectivity EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.
Read more...Dual-range IMU with edge processing EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s innovative LSM6DSV80X combines two accelerometer structures for 16 g and 80 g full-scale sensing, a gyroscope up 4000 dps, and embedded intelligence in a single component.
Read more...MCX C Series development board Avnet Silica
DSP, Micros & Memory
The FRDM-MCXC444 is a compact and scalable development board for rapid prototyping of MCX C444 MCU from NXP Semiconductors.
Read more...Redefining entry-level MCUs NuVision Electronics
DSP, Micros & Memory
The company positions the GD32C231 series as a ‘high-performance entry-level’ solution designed to offer more competitive options for multiple applications.
Read more...High-reliability isolation amplifiers EBV Electrolink
Analogue, Mixed Signal, LSI
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.
Read more...Microchip enhances TrustMANAGER platform Altron Arrow
DSP, Micros & Memory
Firmware over-the-air updates and remote cryptographic key management provide scalable solutions for addressing IoT security challenges.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version