STMicroelectronics is bringing extra flexibility to IO-Link connections with the L6364 transceiver, which features dual communication channels that allow configurable output doubling for extra drive strength, in addition to a DC/DC converter and dual-mode UART.
The chip supports IO-Link at COM2 (38,4 Kbaud) and COM3 (230,4 Kbaud) modes, as well as standard single-input/output (SIO) communication. The dual outputs, comprising an IO-Link CQ pin and standard DIO pin, each have surge-pulse and reverse-polarity protection. The maximum drive strength is programmable up to 250 mA and the two channels can be paralleled to supply up to 500 mA.
An SPI port connects the L6364 to the host microcontroller (MCU), with an additional interrupt pin for diagnostic reporting. Sensor data can be exchanged with the MCU through the UART or by using single-Byte or multi-Byte (SPI) modes. The integrated UART, which supports IO-Link message sequencing (M-Sequencing), can be programmed to operate in IO-Link or standard SIO mode and allows unlimited M-Sequence size in single-octet IO-Link. An internal data buffer supports up to 15 octets.
In normal operation the L6364 is configured by the MCU via the SPI interface at startup. It starts operating in SIO-device mode, driving the output lines as configured by the MCU. If the device is connected to an IO-Link master, the master can initiate IO-Link communication by a wakeup request.
Wi-Fi 6 and Bluetooth LE co-processor Altron Arrow
Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released its ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE combo co-processor module.
Read more...Improving accuracy of outdoor devices iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
In a real-world environment, accessing a direct satellite signal is not always possible, and it cannot be relied upon as the only solution to provide a device with accurate location at all times.
Read more...New 3dB hybrid couplers Electrocomp
Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.
Read more...Next-level Software Defined Radio IOT Electronics
Telecoms, Datacoms, Wireless, IoT
Great Scott Gadgets has announced the HackRF Pro, a powerful evolution of its popular Software Defined Radio (SDR) platform designed for engineers and enthusiasts.
Read more...High-performance Zigbee and BLE module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The KCMA32S from Quectel boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports Zigbee 3.0, BLE 5.3 and BLE mesh.
Read more...Championing local PCB manufacturing Master Circuits
Telecoms, Datacoms, Wireless, IoT
Master Circuits, founded in 1994 by Peter Frankish in Durban, was born from the vision to meet the growing local demand for quick-turnaround printed circuit boards in South Africa.
Read more...IoT-optimised LTE Cat 1 bis module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel’s EG915K-EU is an LTE Cat 1 bis wireless communication module specially designed for M2M and IoT applications.
Read more...1-Wire EEPROM with secure authenticator Altron Arrow
DSP, Micros & Memory
The DS28E54 secure authenticator combines FIPS 202-compliant secure hash algorithm (SHA-3) challenge and response authentication with secured electrically erasable programmable read-only memory.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version