30 March 2022Manufacturing / Production Technology, Hardware & Services
Indium Corporation boasts an extensive portfolio of innovative, high-performance metal thermal interface materials (TIM), some of which will be featured at the impending TestConX conference in Arizona, USA.
The company’s indium-containing TIMs for burn-in and test offer superior thermal conductivity over non-metals, with pure indium metal delivering 86 W/m•K. Its TIMs are available as pure indium, indium-silver alloys and indium-tin, among others. The pure indium TIM can be clad with a thin aluminium layer on the side facing the device under test (DUT) to prevent the indium from adhering to the surface.
Indium’s suite of Heat-Spring solutions, featuring a compressible interface between a heat source and a heatsink, include:
Heat-Spring preforms
• Patterned to optimise contact with non-planar surfaces, delivering 86 W/mK thermal conductivity.
• Provides uniform contact between the burn-in head and the DUT.
• Provides more uniform thermal conductivity.
• Cleans with no residue.
• Recyclable and reclaimable.
Heat-Spring HSK
• Recommended specifically for burn-in applications where multiple insertions are required.
• Provides uniform contact with low resistance for high-density heat loads.
• Typically clad with a thin diffusion barrier, which serves as the contact surface for burn-in and test applications.
• No staining or cracking.
Heat-Spring HSD
• Designed for interfaces with tight surface control above 30 psi.
• Recommended for small, well-designed interfaces with flat, smooth, parallel surfaces.
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