Nordic Semiconductor recently released its nRF5340 Audio Development Kit (DK), a design platform for rapid development of Bluetooth LE Audio products. The audio DK contains everything needed to get started on LE Audio development projects. It is based on Nordic’s nRF5340 system-on-chip (SoC), boasting two Arm Cortex-M33 processors.
LE Audio is described by the Bluetooth Special Interest Group (SIG) as “the future of wireless sound.” The technology is based on the Low Complexity Communications Codec (LC3), an enhanced replacement for the low complexity sub-band codec (SBC) used by Classic Audio. LC3 ensures that LE Audio features both improved audio quality and better battery life than Classic Audio in all use-cases.
Extensive listening tests have shown that at all sample rates, the audio quality of LC3 exceeds that of SBC at the same sample rate and provides equivalent or better audio quality at half the wireless data rate. This lower data rate is a key factor in minimising the power consumption of LE Audio products. LE Audio also brings true wireless stereo (TWS) and other new functions to wireless audio, including audio sharing.
The nRF5340 Audio DK is highly configurable, allowing it to function as a USB dongle to send and receive high-quality audio data from a PC, a business headset or a TWS earbud (most use-cases require two or more nRF5340 DKs). The kit includes two 3,5 mm audio jacks for analog ‘in’ and headphones ‘out’; five user-programmable buttons and LEDs; an SD-Card holder for extra storage; a Segger J-Link debugger for programming and debugging, and connectors to access the analog/digital interfaces and GPIOs.
The DK is typically powered via USB but also has a battery connector for a Li-ion/Li-Po battery. The current consumption can be measured on the board and by using the dedicated current measurement pins and Nordic’s Power Profiler Kit II or other current measuring equipment.
Wi-Fi 6/BLE module enables rapid development Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the WE310K6, a fully integrated, low-power module featuring dual-band, dual-stream Wi-Fi 6, and dual-mode Bluetooth/BLE.
Read more...Low phase noise amplifier RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
The MAAL-011158 from Macom is an easy-to-use low-phase noise amplifier that provides 12 dB of gain in a 32-lead QFN plastic package.
Read more...Full sensor to cloud solution CST Electronics
Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.
Read more...Long-range Wi-Fi HaLow module TRX Electronics
Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.
Read more...Quectel launches 3GPP NTN comms module Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.
Read more...SIMCom’s A7673x series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.
Read more...SiP supports LTE/NB-IoT and GNSS RF Design
DSP, Micros & Memory
The nRF9151 from Nordic Semiconductor is an integrated System-in-Package that supports LTE-M/NB-IoT, DECT NR+ and GNSS services.
Read more...Long-range connectivity module Avnet Silica
Telecoms, Datacoms, Wireless, IoT
Digi XBee XR 868 RF Modules support the deployment of long-range connectivity applications, and support point-to-point and mesh networking protocols.