Integrated SIM represents a revolutionary step forward for all connected devices. It brings a new era of flexibility and choice that is also supported by enhanced security. By no longer requiring the installation of physical plastic cards and taking away the need to either install SIMs at the point of deployment or to embed market-specific SIMs in factories, costs are reduced and logistics simplified.
To explain and examine the evolution of the Sim to the iSIM, Quectel will host a masterclass together with partner Kigen. In it the technology and capability of the iSIM and the integrated variant of embedded universal integrated circuit card (eUICC) will be discussed, as well as how development of scalable high-volume IoT applications can be handled. It will provide an overview of the advantages it brings to IoT solutions and will explain the optimisation of globally-connected product roll-outs.
The Quectel masterclass webinar will take place on Tuesday 12 July 2022 at 5 p.m. CAT and will specifically cover the following topics:
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