Qualcomm has bundled all its AI software offerings into a single package called the Qualcomm AI Stack. Qualcomm said that this new software stack would help OEMs and developers deploy AI applications on Qualcomm products much quicker and easier than before. For the first time, a single AI software portfolio works on every Qualcomm platform spanning the wide range of connected intelligent products – including mobile, automotive, XR, compute, IoT and cloud platforms.
The Qualcomm AI Stack supports AI frameworks such as TensorFlow, PyTorch, ONNX and runtimes including TensorFlow Lite, TensorFlow Lite Micro and ONNX runtime. It includes inferencing SDKs like its Qualcomm Neural Processing SDK with the recently announced Windows version. The rich variety of operating system support includes Android, Windows and ChromeOS, as well as infrastructure operating systems like Prometheus, Kubernetes and Docker.
With OEMs and developers in mind, Qualcomm AI Stack is designed to help develop, optimise and deploy AI models quickly and efficiently on Qualcomm products with regular updates and new features. As part of the new offering, the Qualcomm AI Engine Direct will now scale across every AI accelerator inside a broad range of products. OEMs and developers will have the ability to develop and optimise AI models using the Qualcomm AI Stack once and then move the same model across different products and tiers.
1 GHz crossover MCU with Arm Cortex Cores Future Electronics
DSP, Micros & Memory
i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.
Read more...From idea to intelligent product TRX Electronics
Computer/Embedded Technology
Mouser Electronics has announced a new eBook in collaboration with Arduino – From Blink to Think: How Arduino UNO Q Helps Designers Go from Idea to Intelligent Product.
Read more...Think Diamond Long-life COM-based SBCs Electronic Products Design
Computer/Embedded Technology
A COM-based SBC combines the flexibility of a standard computer-on-module (COM) with a baseboard offering additional I/O, expansion sockets, power supplies, and I/O connectors. The result is a highly flexible, highly expandable, feature-dense product that can be adapted to the widest range of applications, offering maximum product lifetime.
Read more...Next-Gen Min-ITX motherboard Vepac Electronics
Computer/Embedded Technology
Adding to AAEON’s extensive industrial motherboard portfolio, the Next-Gen MIX-Q870A1 is the company’s most advanced Mini-ITX board to date.
Read more...Rev 2.0 PolarFire FPGA ethernet sensor bridge Altron Arrow
Computer/Embedded Technology
Smaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems, while lowering power, cost and integration complexity.
Read more...Intelligent video processing Rugged Interconnect Technologies
Computer/Embedded Technology
The CHARM150AGX is based on a NVIDIA AGX Orin embedded processor, which incorporates a multicore ARM processor and powerful AI/ML accelerator.
Read more...AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Java Card-based solution Future Electronics
Analogue, Mixed Signal, LSI
The SECORA ID Key S USB, from Infineon Technologies, is a Java Card-based solution with USB and NFC connectivity for secured authentication and digital signatures.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version