ams OSRAM has introduced its TMF8806, a 1D Time-of-Flight (ToF) sensor that has been developed to remove the barriers of previous single-zone dToF devices, including TMF8701, TMF8801 and TMF8805.
There is no FW download required to operate this device, saving host MCU memory space, reducing startup time and saving overall system power by enabling customers to quickly startup the device and make measurements in a few milliseconds. This ULP capability means that customers can employ dToF devices in ultra-low power applications, such as battery powered devices, while maximising battery life.
The TMF8806 features a sub-nanosecond light pulse with a 20 to 500 cm sensing distance at 30 Hz. It has on-chip histogram processing and a fast time-to-digital converter architecture. The sensor supports a 1,2 V I2C interface all in a tiny 2,2 x 3,6 x 1 mm package.
Ideal applications include industrial robotics, home and building automation, projection and display, factory automation, and access control and security. It can also be used for computing and in mobile/wearable devices.
Wi-Fi 6 and Bluetooth LE co-processor Altron Arrow
Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released its ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE combo co-processor module.
Read more...Improving accuracy of outdoor devices iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
In a real-world environment, accessing a direct satellite signal is not always possible, and it cannot be relied upon as the only solution to provide a device with accurate location at all times.
Read more...New 3dB hybrid couplers Electrocomp
Telecoms, Datacoms, Wireless, IoT
Designed to facilitate the continued evolution of high-frequency wireless systems in various market segments, the new DB0402 3dB 90° hybrid couplers provide repeatable high-frequency performance compatible with automated assembly.
Read more...Next-level Software Defined Radio IOT Electronics
Telecoms, Datacoms, Wireless, IoT
Great Scott Gadgets has announced the HackRF Pro, a powerful evolution of its popular Software Defined Radio (SDR) platform designed for engineers and enthusiasts.
Read more...High-performance Zigbee and BLE module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
The KCMA32S from Quectel boasts an ARM Cortex-M33 processor with a frequency of up to 80 MHz, and supports Zigbee 3.0, BLE 5.3 and BLE mesh.
Read more...Championing local PCB manufacturing Master Circuits
Telecoms, Datacoms, Wireless, IoT
Master Circuits, founded in 1994 by Peter Frankish in Durban, was born from the vision to meet the growing local demand for quick-turnaround printed circuit boards in South Africa.
Read more...IoT-optimised LTE Cat 1 bis module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel’s EG915K-EU is an LTE Cat 1 bis wireless communication module specially designed for M2M and IoT applications.
Read more...New SiC power MOSFET Future Electronics
Power Electronics / Power Management
STMicroelectronics’ SCT012H90G3AG is a robust, automotive-grade SiC MOSFET, engineered for demanding power electronics, featuring a 900?V drain-source voltage and exceptionally low on-resistance of 12?mO at 60?A.
Read more...Chip provides concurrent dual connectivity EBV Electrolink
Telecoms, Datacoms, Wireless, IoT
The IW693 from NXP is a 2x2 dual-band, highly integrated device that provides concurrent dual Wi-Fi 6E + Wi-Fi 6 and Bluetooth connectivity, supporting four different modes.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.