Manufacturing / Production Technology, Hardware & Services


Weller WXSMART all-in-one smart soldering station

26 October 2022 Manufacturing / Production Technology, Hardware & Services

Weller’s WXSMART soldering station is an all-in-one solution for any soldering and reworking requirements. It is currently the most connected, controlled and secured hand soldering system available.

The WXSMART is a centralised control station which acts to consolidate all soldering applications by controlling multiple devices concurrently, to provide total process control over the complete soldering process.

Connectivity is provided via the control station, which supports IoT standards for full traceability and easy remote access. Hardware interfaces on the WXSMART include Wi-Fi, LAN, USB and UART to support any connection type. The unit is Industry 4.0 ready and can be integrated into existing ERP systems. The highest security standards, using TLS encryption, are used and 2FA provides another level of security when accessing the control unit. This is also the first soldering system to provide built-in cybersecurity to prevent costly downtime.

Besides the built-in 4,3-inch colour touchscreen, Weller software is available that provides a real-time dashboard on PC, smartphone or tablet to monitor and control the complete system. The smartphone/tablet app provides a real-time power and temperature graph. Provided control includes temperature adjustments, iron on/off, and indicator colour change. The system can be remotely locked to prevent unauthorised use.

MES integration is also provided for, with the control unit having an MQTT broker. All parameters are available as a JSON structure for monitoring and control via a third-party system.

The WXSMART system includes smart tips which have an integrated chip in each soldering tip. This allows precise control over temperature profiles when using the system. The full rework station provides high-precision soldering to heavy-duty soldering and can accommodate reworking, hot air and desoldering with the respective tools attached.

The centralised system has a fume extraction system, a preheating plate, soldering bath and calibration unit. With a fast heat-up time of three seconds and excellent heat transfer and recovery time, waiting is now a thing of the past. The intelligent irons connected to the WXSMART control unit can store up to ten parameter settings, to customise the iron for different applications.

The WXSMART intelligent soldering system can be used for through-hole and SMD soldering, reworking, repairs and R&D.;


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.

Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.

Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.

Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.

Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.

Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.

Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.

Read more...
Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved