DSP, Micros & Memory


Scaling ML processing with external AI accelerators

23 November 2022 DSP, Micros & Memory AI & ML

At NXP, we craft our i.MX applications processors and our i.MXX RT crossover microcontroller (MCU) portfolios and families of devices to cover a very wide spectrum of market needs. From verticals needing very low-power dissipation to other end products needing a complex heterogeneous compute platform with multiple CPUs, 2D-3D GPUs, DSPs and NPU machine learning accelerators, our product teams must solve a multi-dimensional optimisation problem. The ultimate goal is to deliver all the compute power and connectivity your application and products need, with minimal unused features so that the area footprint, power dissipation, and cost requirements of the devices are also met.

When talking about machine learning, there are some end uses such as autonomous vehicles and natural language processing that push the compute requirements for edge devices to limits of tens and hundreds of tera operations per second (TOPs). With more emphasis on developing efficient ML models specifically for the edge, and using techniques such as quantisation and pruning, many of the edge machine learning applications fit in the

Giga-Ops to low single digit TOPs range of ML compute performance. NXP solutions natively cover this large portion of AI processing needs.

The software investment dominates the hardware choice these days, especially when considering roadmaps and multiple generation of products. There is a clear benefit to choosing the same or similar applications processor when developing a range of end products, so that the development effort translates to higher maturity and quality, with reuse. Different market segments require different performance on some portion of the application, but the fundamentals remain unchanged between versions and tiers of products. Choosing a scalable processor family such as i.MX applications processors gives the developer flexibility in advanced features and performance range, while simultaneously providing a common base compute architecture and feature set to leverage across both the portfolio and common software enablement elements. NXP provides GStreamer and NNStreamer frameworks to simplify deployment of vision applications with ML.X GStreamer is used as a framework for creating streaming media applications, abstracting the hardware layer to allow the use of any i.MX SoC, without having to change the underlying vision pipeline software.

Application requirements and markets evolve even after a product is launched in the market. So, what does one do when more is still needed from the selected applications processor? Going back to the selection process and looking for a higher performance processor is usually not a preferred option. Adding another device to provide additional acceleration when needed is a possible path, especially with high-speed high bandwidth, low latency chip-to-chip connectivity options such as PCIe. This is where NXP’s ecosystem partners with dedicated ML accelerator chips can help.

Kinara is such an NXP ecosystem partner that develops the Ara-1 Edge AI processors for dedicated ML acceleration. The Gstreamer- and NNStreamer-based vision pipeline support offered by NXP, and the set of Kinara-developed Gstreamer compatible plugins, make it seamless to integrate Ara-1X into NXP inference pipelines and to also easily migrate the design to different i.MXX applications processors if the feature requirements change.

Combining the native MLX processing capabilities of NXP’sX i.MXX applications processors with dedicated MLX accelerators from NXP ecosystem partners such as Kinara, creates an even larger scalability range than that offered by NXP alone while still maintaining software reuse.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...
AI-ready edge MPU for HMIs
Future Electronics DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

Read more...
Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.

Read more...
Universal NFC device
Altron Arrow DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

Read more...
Compact low-power 32-bit platform
EBV Electrolink DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

Read more...
Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

Read more...
Low-power memory born for edge AI
iCorp Technologies DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.

Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
Next-gen smart module powers intelligence at the edge
iCorp Technologies DSP, Micros & Memory
Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.

Read more...
SoC brings scalable edge AI to life
Altron Arrow AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved