VIA Technologies has announced the launch of the ruggedised VIA AMOS-3007 intelligent edge system. This system is designed for the most demanding Industrial IoT use cases ranging from equipment monitoring and process automation to rich data visualisation and facilities management.
Powered by a fanless 1,5 GHz Intel Atom quad core processor, the VIA AMOS-3007 packs a rich I/O and connectivity feature set in a ruggedised ultra-compact enclosure measuring just 70 x 48,5 x 126 mm (W x H x D). The system’s VESA mounting options ensure that it can be easily fitted into the most constrained spaces, and its wide operating temperature range of -20 to 70 °C ensures reliable operation in most industrial environments.
The VIA AMOS-3007 solution provides a wealth of I/O and connectivity options, including two Gigabit Ethernet ports, two lockable USB 2.0 and two USB 3.0 ports, two HDMI connectors supporting dual displays, two COM ports, and one DIO port for 8-bit GPIO. Internal expansion options including three M.2 slots for SATA storage and wireless expansion models, one 4G/5G SIM card slot, and one DDR4 SODIMM slot that supports up to 32 GB of RAM.
“The VIA AMOS-3007 provides the complete package of high performance, low power, and rich I/O connectivity required for the most demanding IIoT use cases,” said Richard Brown, VP of international marketing, VIA Technologies. “With its ruggedised design and support for a wide operating temperature range, this robust, ultra-compact system delivers rock-solid reliability in the toughest operating environments.”
Intelligent video processing Rugged Interconnect Technologies
Computer/Embedded Technology
The CHARM150AGX is based on a NVIDIA AGX Orin embedded processor, which incorporates a multicore ARM processor and powerful AI/ML accelerator.
Read more...Nordic expands nRF Cloud with firmware vulnerability scanning RF Design
Computer/Embedded Technology
nRF Cloud identifies vulnerabilities in firmware and shows exactly which deployed devices are affected, empowering device manufacturers to address EU Cyber Resilience Act requirements.
Read more...Arrival of the Epic-PTH9 Vepac Electronics
Computer/Embedded Technology
AAEON introduces the EPIC-PTH9, a compact 4-inch industrial single-board computer powered by Intel Core Ultra Series 3 (formerly Panther Lake) processors.
Read more...An industry-first Android 16 smart module solution RF Design
Computer/Embedded Technology Telecoms, Datacoms, Wireless, IoT
The MeiG Smart SLM580 4G Smart Module features native support for Android 16 and covers core frequency bands in major countries and regions worldwide.
Read more...MIKROE celebrates 2000th Click board
Computer/Embedded Technology
MIKROE has launched its 2000th Click board, the RTC 27 Click, designed for low-power real-time clock and calendar functionality, time tracking, alarm event generation, watchdog timing, and timestamp capture.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version