Manufacturing / Production Technology, Hardware & Services


Soldering robot: case study

EMP 2023 Electronics Manufacturing & Production Handbook Manufacturing / Production Technology, Hardware & Services

Automotive soldering applications have increased dramatically with the new technology presented by electric and hybrid vehicles. The need for faster and more precise soldering machines has never been greater than it is now.

With the increase in electric vehicles, more parts and components on each vehicle have made the move from a previously mechanical system to a fully electric system utilising motors and actuators. With the increase in electronics within automobiles, the parts that have changed are mostly in the fields of actuators, fuel efficiency, safety, comfort, and amenity.

Due to the use of electric motors as actuators, the need for both motors and motor drivers has increased. Additionally, a high number of ECU and DC-DC converters are being used for power and control.

With the change to hybrid and electric vehicles, parts that were previously driven by the engine have now become electric. This includes the air conditioning compressor and water pump used to circulate engine coolant fluid.

Most safety features are based on an electric signal fed back to the control system. ABS and airbags are an example of electronic safety features which activate in an instant and can only be implemented with the use of electronics. Collision avoidance and prevention systems also have electronic controls as their foundation.

GPS/infotainment systems keyless entry, reverse monitors/cameras, automatic seat position are more examples of added electronic systems that appear on all modern vehicles.

All these systems have one thing in common – they have all been manufactured and mounted by means of soldering. It can, therefore, be seen that soldering plays a vital role in the manufacture of automobiles. The powerful technology behind automobiles can have a significant impact on human life, should something go awry. With the increase in these electronically controlled parts, the solder used in on-board vehicular electronics must be maintained at a much higher quality and reliability standard than that of regular electronics.

The Solder Meister Universe Series soldering robot has been developed as the perfect robot for these challenging automobile soldering applications where it unites electronic component picking, substrate insertion, and soldering into one sequence.

The robot uses a SCARA robot arm above the substrate and an articulated robot below the substrate to handle insertions. It takes advantage of a feeding unit which provides solder on demand, significantly reducing the amount of solder used.

All path lengths are handled automatically, cutting the previous cycle time by two-thirds. In addition to this time saving, the footprint of the equipment has also been reduced. Labour costs and product quality percentages are two more areas that have seen improvement.

Case in point, at one factory where the Universe S was installed, it previously took one labourer 150 seconds to solder-mount one component. The Universe S can now complete the same task in approximately 55 seconds, with a resultant major time saving. Furthermore, whereas the factory’s previous soldering product quality percentage was 95%, this has now improved to 100% because of the uniformity introduced by the robot. This is largely due to the vision sensor that can identify defective pieces and automatically discard them before insertion takes place.

Lastly, because the soldering process is now performed by laser, the soldering iron tip’s heat dissipation and related replacements are no longer an issue, which has resulted in a large cost saving. Maintenance has similarly not been needed, resulting in the factory being able to achieve full production 24 hours a day.




Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.

Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.

Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.

Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.

Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.

Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.

Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.

Read more...
Material challenges for superconducting quantum chips
Manufacturing / Production Technology, Hardware & Services
To achieve the scalable and repeatable production of superconducting circuits for quantum technology products, players in the industry are leveraging semiconductor fabrication techniques.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved